Electrical characteristics and detailed interfacial structures of Ag/Ni metallization on polycrystalline thermoelectric SnSe
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2019年第5期
论文作者：Yeongseon Kim Younghwan Jin Giwan Yoon In Chung Hana Yoon Chung-Yul Yoo Sang Hyun Park
文章页码：711 - 718
摘 要：SnSe is a promising thermoelectric material with a high figure of merit in single crystal form, which has stimulated continuous research on polycrystalline SnSe. In this study, we investigated a metallization techniques for polycrystalline SnSe to achieve highly efficient and practical SnSe thermoelectric modules. The Ag/Ni metallization layers were formed on pristine polycrystalline SnSe using various deposition technique: sputter coating Ni, powder Ni and foil Ni by spark plasma sintering. Structural analysis demonstrated that the microstructure and contact resistance could be different according to the metallization process, despite using the same metals. The Ag/Ni metallization layer using foil Ni acted as an effective diffusion barrier and minimized electrical contact resistance(2.3 × 10-4 Ω cm2). A power loss in the thermoelectric module of only 5% was demonstrated using finite element simulation.
Yeongseon Kim1,2，Younghwan Jin3，Giwan Yoon2，In Chung4，Hana Yoon1，Chung-Yul Yoo1，Sang Hyun Park1
1. Separation and Conversion Materials Laboratory, Korea Institute of Energy Research2. School of Electrical Engineering, Korea Advanced Institute of Science and Technology3. Department of Physics, Chungnam National University4. School of Chemical and Biological Engineering, Seoul National University
摘 要：SnSe is a promising thermoelectric material with a high figure of merit in single crystal form, which has stimulated continuous research on polycrystalline SnSe. In this study, we investigated a metallization techniques for polycrystalline SnSe to achieve highly efficient and practical SnSe thermoelectric modules. The Ag/Ni metallization layers were formed on pristine polycrystalline SnSe using various deposition technique: sputter coating Ni, powder Ni and foil Ni by spark plasma sintering. Structural analysis demonstrated that the microstructure and contact resistance could be different according to the metallization process, despite using the same metals. The Ag/Ni metallization layer using foil Ni acted as an effective diffusion barrier and minimized electrical contact resistance(2.3 × 10-4 Ω cm2). A power loss in the thermoelectric module of only 5% was demonstrated using finite element simulation.
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