Effects of Micro-Amount of Cerium on Microstructures of Sn-Ag-Cu Solder and Soldered Joint
来源期刊：Journal of Rare Earths2006年第S2期
论文作者：韩宗杰 薛松柏 刘琳 王俭辛 吴玉秀 黄翔 王慧
文章页码：228 - 232
摘 要：Effects of micro-amount of rare earth Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results indicate that microstructures of Sn-Ag-Cu-Ce solder alloy are composed of Sn-rich phase and eutectic structures, including two binary eutectic structures （granular Cu6Sn5+β-Sn and needle-like/flake Ag3Sn+β-Sn） and one ternary eutectic structure Cu6Sn5+Ag3Sn+β-Sn emerged among β-Sn dendrites, some intermetallic compounds （IMC） and Ce compounds also exist. Microstructure of solder alloy becomes finer with the increase of the content of Ce, and the optimum content of Ce is about 0.03%, the binary eutectic of needle-like/flake Ag3Sn+β-Sn becomes fine equiaxed crystal; coarse compound phases exist when the content of Ce is up to 0.1%, which is harmful to microstructures of solder alloy and soldering seam. With regard to soldered joints, microstructures formation of the interface between Sn-Ag-Cu-Ce solder and Cu substrate （soldering seam） is different from that of Sn-Ag-Cu-Ce alloy itself, as a result of different cooling speed and dissolution of Cu into solder alloy.
韩宗杰，薛松柏，刘琳，王俭辛，吴玉秀，黄翔，王慧
摘 要：Effects of micro-amount of rare earth Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results indicate that microstructures of Sn-Ag-Cu-Ce solder alloy are composed of Sn-rich phase and eutectic structures, including two binary eutectic structures （granular Cu6Sn5+β-Sn and needle-like/flake Ag3Sn+β-Sn） and one ternary eutectic structure Cu6Sn5+Ag3Sn+β-Sn emerged among β-Sn dendrites, some intermetallic compounds （IMC） and Ce compounds also exist. Microstructure of solder alloy becomes finer with the increase of the content of Ce, and the optimum content of Ce is about 0.03%, the binary eutectic of needle-like/flake Ag3Sn+β-Sn becomes fine equiaxed crystal; coarse compound phases exist when the content of Ce is up to 0.1%, which is harmful to microstructures of solder alloy and soldering seam. With regard to soldered joints, microstructures formation of the interface between Sn-Ag-Cu-Ce solder and Cu substrate （soldering seam） is different from that of Sn-Ag-Cu-Ce alloy itself, as a result of different cooling speed and dissolution of Cu into solder alloy.
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