生长速率对定向凝固Zn-Al-Bi共晶合金显微组织、力学性能和电学性能的影响

来源期刊:中国有色金属学报(英文版)2016年第9期

论文作者:Yasin KARAMAZI ümit BAYRAM P?nar ATA Sezen AKS?Z Kaz?m KE?L?O?LU Necmettin MARA?LI

文章页码:2320 - 2335

关键词:定向凝固;锌铝合金;显微组织;显微硬度;拉伸强度;电学性能

Key words:directional solidification; zinc-aluminum alloy; microstructure; microhardness; tensile strength; electrical properties

摘    要:采用Bridgman型定向凝固炉在一定温度梯度和不同生长速率下制备Zn-5%Al-0.2%Bi(质量分数)合金。测量了定向凝固Zn-Al-Bi合金的枝晶间距、显微硬度、抗拉强度和电阻率。采用线性回归分析研究生长速率对合金枝晶间距、显微硬度、抗拉强度和电阻率的影响。在低生长速率下(小于450.0 μm/s),所得结果与在相似生长速率下定向凝固的Zn-Al合金的结果吻合,但与Jackson-Hunt共晶理论和高生长速率下的实验结果不同。Zn-Al-Bi共晶合金的临界生长速率为450 μm/s。从热流-温度曲线中可以得到,Zn-Al-Bi合金的熔化焓、固液相比热差以及熔化温度分别为112.55 J/g、0.291 J/(g?K)和660.20 K。

Abstract: Zn-5%Al-0.2%Bi (mass fraction) alloy was directionally solidified upward at a constant temperature gradient with a wide range of growth rates using a Bridgman-type directional solidification furnace. The eutectic spacings, microhardness, ultimate tensile strength and electrical resistivity for directionally solidified Zn-Al-Bi alloy were measured. Dependence of eutectic spacings, microhardness, ultimate tensile strength and electrical resistivity on growth rates was obtained by linear regression analysis. The results obtained in the present work for low growth rates (smaller than 450.0 μm/s) are in good agreement with experimental results obtained in previous work for directional solidified Zn-Al eutectic alloy with a similar growth rate but differs from the Jackson-Hunt eutectic theory and those obtained in previous experimental works at higher growth rates. The critical growth rate might be 450.0 μm/s for the Zn-Al-Bi eutectic alloy. From the plot of heat flow versus temperature, enthalpy of fusion, specific heat difference between liquid and solid phases and melting temperature for the Zn-Al-Bi alloy are found to be 112.55 J/g, 0.291 J/(g·K) and 660.20 K, respectively.

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