Microstructural,Mechanical,Electrical,and Thermal Properties of the Bi-Sn-Ag Ternary Eutectic Alloy
来源期刊：Journal Of Wuhan University Of Technology Materials Science Edition2017年第1期
论文作者：KAYA Hasan AKER Aynur BüYüK U?ur
文章页码：147 - 154
摘 要：The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries.Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature.We investigated the effects of temperature gradient and growth rate on the mechanical,electrical and thermal properties of the BiSn-Ag ternary eutectic alloy.Bi-47 wt%Sn-0.68 wt%Ag alloy was directionally solidified upward with different temperature gradients（G=2.33-5.66 K/mm） at a constant growth rate（V=13.25 μm/s） and with different growth rates（V=6.55-132.83 μm/s） at a constant temperature gradient（G=2.33 K/mm） in the growth apparatus.The microstructures（λ）,microhardness（HV）,tensile stress（σ）,electrical resistivity（ρ）,and thermal properties（△H,Cp,Tm） were measured on directionally solidified samples.The dependency of the λ,HV,σ,and ρ on G and V was investigated.According to the experimental results,X values decrease with increasing G and V,but HV,λ,and ρ values increase with increasing G and V.Variations of electrical resistivity（ρ） for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique.The enthalpy of fusion（△H） and specific heat（Cp） for the same alloy was also determined by means of differential scanning calorimeter（DSC） from heating trace during the transformation from eutectic liquid to eutectic solid.
KAYA Hasan1，AKER Aynur3，BüYüK U?ur1
1. Faculty of Education, Department of Science Education, Erciyes University3. Faculty of Education, Department of Computer and Instructional Technologies, Siirt University
摘 要：The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries.Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature.We investigated the effects of temperature gradient and growth rate on the mechanical,electrical and thermal properties of the BiSn-Ag ternary eutectic alloy.Bi-47 wt%Sn-0.68 wt%Ag alloy was directionally solidified upward with different temperature gradients（G=2.33-5.66 K/mm） at a constant growth rate（V=13.25 μm/s） and with different growth rates（V=6.55-132.83 μm/s） at a constant temperature gradient（G=2.33 K/mm） in the growth apparatus.The microstructures（λ）,microhardness（HV）,tensile stress（σ）,electrical resistivity（ρ）,and thermal properties（△H,Cp,Tm） were measured on directionally solidified samples.The dependency of the λ,HV,σ,and ρ on G and V was investigated.According to the experimental results,X values decrease with increasing G and V,but HV,λ,and ρ values increase with increasing G and V.Variations of electrical resistivity（ρ） for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique.The enthalpy of fusion（△H） and specific heat（Cp） for the same alloy was also determined by means of differential scanning calorimeter（DSC） from heating trace during the transformation from eutectic liquid to eutectic solid.
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