液相置换沉积制备电器触头用银钨包复粉末

来源期刊：中南大学学报(自然科学版)1997年第4期

论文作者：陈慧光 张多默 郭学益 刘志宏

文章页码：340 - 342

关键词：复合粉末； 置换沉积； 触头材料

Key words：composite powder； cementation； electrical contact material

摘    要：在硝酸银氨性溶液中，采用钨粉置换沉积法对电器触头用银钨包复粉末的制备进行了研究，探讨了工艺条件对银包复钨效果的影响．结果表明，在合适的工艺条件下，液相互换沉积是一种制得成分均匀、包复完整的银钨复合粉末十分有效且简单易行的方法.

Abstract: In ammonical silver nitrate solution, the research was done on silver-coated tungsten composite powders preparation which could be used in electrical contact manufacture by cementation of tungsten powder.The effect of processing conditions on the deposition of silver upon tungsten was investigated. The results indicated that the cementation was an effective and simple method to prepare well-covered silver-coated tungsten eomposite powders in uniform composition under proper conditions.