Thermo-physical properties of Sip/LD11 composites for electronic packaging
来源期刊：中国有色金属学报(英文版)2005年第z2期
论文作者：修子扬 武高辉 张强 宋美慧
文章页码：227 - 230
Key words：Si particles； aluminum matrix composite； thermal expansion； thermal conductivity
Abstract: The Sip/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Sip/LD11 are decreased. The CTEs of Sip/LD11 can be adjusted between 8.3×10-6-12×10-6/℃, and the thermal conductivity is larger than 87.7W/ (m·℃). This meets the requirements of electronic packaging material. The CTEs of Sip/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTEs of Sip/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.
