Manufacturing process and microstructure of copper-coated aluminum wires

Xiao-hua Chen^1,2，Xin Tang³，Zi-dong Wang³，Xi-dong Hui¹，Mo Li²，Yong-wei Wang⁴

1. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing2. School of Materials Science and Engineering, Georgia Institute of Technology3. School of Materials Science and Engineering, University of Science and Technology Beijing4. School of Mechanical Engineering, University of Science and Technology Beijing

摘 要：Copper-coated aluminum wires exhibit good electrical conductivity, high thermal conductivity, low contact resistance of copper and low density, and provide economic advantages over aluminum. However, there are some problems in the manufacturing processes of hot-dip copper-coated aluminum wires, such as the difficulties in controlling coating process. In this work, the hot-dip copper-coating method of aluminum wires was investigated for producing copper-coated aluminum wire composites. The interface microstructure between the aluminum wire and the copper coating layer was analyzed by scanning electron microscopy（SEM） and energy-dispersive X-ray spectrometry（EDS）. Five different fluxing agents were tested. Experimental results show that appropriate conditions for the hot-dip process are determined as the liquid copper temperature of 1085°C and the treatment time less than 1 s. A success in hot-dip copper-coated aluminum wires is achieved by hot-dipping a low-melting-point metal into a high-melting-point metal liquid, which is significant for the further development and application of copper-coated aluminum wire composites.

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