Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials
来源期刊：Acta Metallurgica Sinica2014年第2期
论文作者：E.Yang Hongyan Guo Jingdong Guo Jianku Shang Mingguang Wang
文章页码：290 - 294
摘 要：Thermal resistance of low-melting-temperature alloy（LMTA） thermal interface materials（TIMs） was measured by laser flash method before and after different stages of heating.The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process.It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs.Due to the fast growth rate of intermetallic compound（IMC） at the solid–liquid interface,a thick brittle IMC is layer formed at the interface,which makes cracks easy to initiate and expand.Otherwise,the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase,and so,the TIM layer will not melt at the operating temperature.
E.Yang1,2，Hongyan Guo1，Jingdong Guo1，Jianku Shang1,3，Mingguang Wang2
1. Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences2. College of Sciences,Northeastern University3. Department of Materials Science and Engineering,University of Illinois at Urbana-Champaign
摘 要：Thermal resistance of low-melting-temperature alloy（LMTA） thermal interface materials（TIMs） was measured by laser flash method before and after different stages of heating.The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process.It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs.Due to the fast growth rate of intermetallic compound（IMC） at the solid–liquid interface,a thick brittle IMC is layer formed at the interface,which makes cracks easy to initiate and expand.Otherwise,the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase,and so,the TIM layer will not melt at the operating temperature.
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