Adhesive strength of CVD diamond thin films quantitatively measured by means of the bulge and blister test

Daohui Xiang1, 2), Ming Chen1), Yuping Ma1), and Fanghong Sun1) 1) School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China 2) School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China

摘 要：Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition （CVD） diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitative evaluation of the adhesive strength. The blister test is a potentially powerful tool for characterizing the mechanical properties of diamond films. In this test, pressure was applied on a thin membrane and the out-of-plane deflection of the membrane center was measured. The Young’s modulus, residual stress, and adhesive strength were simultaneously determined using the load-deflection behavior of a membrane. The free-standing window sample of diamond thin films was fabricated by means of photolithography and anisotropic wet etching. The research indicates that the adhesive strength of diamond thin films is 4.28±0.37 J/m2. This method uses a simple apparatus, and the fabrication of samples is very easy.

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