Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique
来源期刊：Rare Metals2020年第11期
论文作者：Yan-Qiang Liu Jian-Zhong Fan Xin-Xiang Hao Shao-Hua Wei Jun-Hui Nie Zi-Li Ma Ming-Kun Liu Ya-Bao Wang
文章页码：1307 - 1313
摘 要：Silicon/aluminum（Si/Al） composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of thermal expansion（CTE） and high thermal conductivity were produced by powder metallurgy（PM）.The Si/Al composites are fully dense and have fine Si particles uniquely distributed within pure Al matrix.Three 50%Si/Al composites were designed to have strength in the range of 185-290 MPa to meet different demands,while the other properties keep invariable.Fracture toughness of the composites is measured to be 9-10 MPa·m1/2.The composites were machined to 50%Si/Al housings and 27%Si/Al lids.Both the hermeticities of housings before and after laser-beam-welding sealing are determined.The measured leak rate of composites and sealed housings is in magnitude order of 1×10-10 and 1×10-9 Pa·m3·s-1,respectively,suggesting high hermeticity.The good hermeticity is attributed to the full dense materials,good weldability,and extremely low weld porosity.The present Si/Al composites are expected to be extensively used in highly hermetic electronic packages.
Yan-Qiang Liu，Jian-Zhong Fan，Xin-Xiang Hao，Shao-Hua Wei，Jun-Hui Nie，Zi-Li Ma，Ming-Kun Liu，Ya-Bao Wang
National Engineering and Technology Research Center for Nonferrous Metals Composites, General Research Institute for Nonferrous Metals
摘 要：Silicon/aluminum（Si/Al） composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of thermal expansion（CTE） and high thermal conductivity were produced by powder metallurgy（PM）.The Si/Al composites are fully dense and have fine Si particles uniquely distributed within pure Al matrix.Three 50%Si/Al composites were designed to have strength in the range of 185-290 MPa to meet different demands,while the other properties keep invariable.Fracture toughness of the composites is measured to be 9-10 MPa·m1/2.The composites were machined to 50%Si/Al housings and 27%Si/Al lids.Both the hermeticities of housings before and after laser-beam-welding sealing are determined.The measured leak rate of composites and sealed housings is in magnitude order of 1×10-10 and 1×10-9 Pa·m3·s-1,respectively,suggesting high hermeticity.The good hermeticity is attributed to the full dense materials,good weldability,and extremely low weld porosity.The present Si/Al composites are expected to be extensively used in highly hermetic electronic packages.
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