Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling

来源期刊：中国有色金属学报(英文版)2001年第4期

论文作者：马鑫 钱乙余 F. Yoshida

文章页码：471 - 474

Key words：finite element simulation; surface mounted solder joint; thermal cycling; mechanical response

Abstract: Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.