图书来源:二元合金相图及中间相晶体结构 二元合金相图及中间相晶体结构
作 者:唐仁政 田荣璋
出版时间:2009-05
定 价:320元
图书ISBN:978-7-81105-831-4
出版单位:中南大学出版社
X.J. Wang1), Q.L. Zeng1), Q.S. Zhu1), Z.G. Wang1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China 2) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
摘 要:Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples of eutectic Sn-3.8Ag-0.7Cu (SAC) joined by Cu plates at two sides. The electromigration tests were conducted at a current density of about 1.1×103 A/cm2 and a working temperature of about 83℃. The results showed that the shear strength and flow stress decreased greatly after current stressing. Such a decrease was associated with no significant loss of the fracture strain at short electromigration but a great reduction in the fracture strain after long-term current stressing. The variation of the fracture strain with the electromigration time was shown to result from the shift of the fracture surface from the center of the solder towards the intermetallic compound (IMC) interface at the cathode.
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