Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2020年第11期
论文作者：Jian Yang Zhang Bin Xu Naeemul Haq Tariq Ming Yue Sun Dian Zhong Li Yi Yi Li
文章页码：1 - 11
摘 要：As an advanced solid state bonding process, plastic deformation bonding（PDB） is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling. In this study, PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions. It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization（DDRX） at 1000–1150℃. Electron backscattered diffraction（EBSD） and transmission electron microscopy（TEM） results revealed that the bonding of joints is related with interfacial grain boundary（IGB） bulging process, which is considered as a nucleation process of DRXed grain under different deformation environments. During recrystallization process, the bonded interface moved due to strain-induced boundary migration（SIBM） process. Stored energy difference（caused by accumulation of dislocations at the bonding interface） was the dominant factor for SIBM during DRX. The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB.
Jian Yang Zhang1,2,3，Bin Xu1,3，Naeemul Haq Tariq4，Ming Yue Sun1,3，Dian Zhong Li3，Yi Yi Li1
1. Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences2. School of Materials Science and Engineering, University of Science and Technology of China3. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences4. Department of Metallurgy and Materials Engineering, Pakistan Institute of Engineering and Applied Sciences
摘 要：As an advanced solid state bonding process, plastic deformation bonding（PDB） is a highly reliable metallurgical joining method that produces significant plastic deformation at the bonding interface of welded joints through thermo-mechanical coupling. In this study, PDB behavior of IN718 superalloy was systematically investigated by performing a series of isothermal compression tests at various processing conditions. It was revealed that new grains evolved in the bonding area through discontinuous dynamic recrystallization（DDRX） at 1000–1150℃. Electron backscattered diffraction（EBSD） and transmission electron microscopy（TEM） results revealed that the bonding of joints is related with interfacial grain boundary（IGB） bulging process, which is considered as a nucleation process of DRXed grain under different deformation environments. During recrystallization process, the bonded interface moved due to strain-induced boundary migration（SIBM） process. Stored energy difference（caused by accumulation of dislocations at the bonding interface） was the dominant factor for SIBM during DRX. The mechanical properties of the bonded joints were dependent upon the recrystallized microstructure and SIBM ensued during PDB.
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