FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling

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ÎÄÕÂÒ³Â룺317 - 322

Key words£ºCBGA£» thermal cycling£» FEM£» reliability

Abstract: The method on 3D FEM is used to analyze the stress and strain process of ceramic ball grid array (CBGA) components micro-joints under thermal cycling condition. By 3D FEM numerical simulation analysis of the CBGA components interior mechanical properties under the thermal cycling loads, stress and strain distribution of the micro-joints of three different kinds of BGA sphere diameter (0.76, 1.0, 1.3¤@mm) were analyzed. The micro-joints thermal fatigue life was evaluated on the basis of 3D FEM numerical simulation analysis. It is shown that the FEM is available to study the micro-joints reliability in the micro electronic packaging and to evaluate the reliability of soldered CBGA joints under thermal cycling because the simulated data are close to the experimental results. ¸ü¶à