Application of the Blister Test in Study of Epoxy Adhesive
来源期刊：材料科学与工程学报2000年增刊第2期
论文作者：Fei Xiong Ingegerd Annergren
关键词：blister test; delamination; debonding; pre-creack; adhesion;
摘 要：Shaft-loaded blister test technique is used as an effective quantitative tool to measure adhesion strength. Investigation on conductive adhesive was done by modified blister test. It is found that shaftloaded blister test can be a good solution for the debonding of thin film adhesion. The intrinsic stable interface debonding process has been proved an attractive alternative to the conventional adhesion measurement techniques. In our study, epoxy matrix adhesive was studied using blister test technique in comparison with the traditional test-lap shear test. Adhesion strength was studied as a function of surface treatment and the metallization of substrate. It was found that surface conditions of substrate have significant impact on adhesion behaviour. The oxidation of surface is responsible for the poor adhesion. Activating chemical treatment and Plasma cleaning on substrate surface has been found to be a way of dreamatically improving adhesion strength of electronic conductive adhesive.
Fei Xiong1，Ingegerd Annergren2
(1.Industrial Research Institute Swinburne (IRIS;
2.Gintic Institute of Manufacturing Technology, Singapore 63875)
摘要:Shaft-loaded blister test technique is used as an effective quantitative tool to measure adhesion strength. Investigation on conductive adhesive was done by modified blister test. It is found that shaftloaded blister test can be a good solution for the debonding of thin film adhesion. The intrinsic stable interface debonding process has been proved an attractive alternative to the conventional adhesion measurement techniques. In our study, epoxy matrix adhesive was studied using blister test technique in comparison with the traditional test-lap shear test. Adhesion strength was studied as a function of surface treatment and the metallization of substrate. It was found that surface conditions of substrate have significant impact on adhesion behaviour. The oxidation of surface is responsible for the poor adhesion. Activating chemical treatment and Plasma cleaning on substrate surface has been found to be a way of dreamatically improving adhesion strength of electronic conductive adhesive.
关键词:blister test; delamination; debonding; pre-creack; adhesion;
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