Comparison of microstructures in electroformed and spin-formed copper liners of shaped charge undergone high-strain-rate deformation

来源期刊:中国有色金属学报(英文版)2007年第6期

论文作者:范爱玲 李树奎 田文怀 王富耻

文章页码:1447 - 1450

Key words:microstructures; copper liners; high-strain-rate deformation; dynamic recovery and recrystallization

Abstract: The as-formed and post-deformed microstructures in both electroformed and spin-formed copper liners of shaped charge were studied by optical microscopy(OM), electron backscattering Kikuchi patterns(EBSP) technique and transmission electron microscopy(TEM). The deformation was carried out at an ultra-high strain rate. OM analysis shows that the initial grains of the electroformed copper liner are finer than those of the spin-formed copper liners. Meanwhile, EBSP analysis reveals that the fiber texture exists in the electroformed copper liners, whereas there is no texture observed in the spin-formed copper liners before deformation. Having undergone high-strain-rate deformation the grains in the recovered slugs, which are transformed from both the electroformed and spin-formed copper liners, all become small. TEM observations of the above two kinds of post-deformed specimens show the existence of cellular structures characterized by tangled dislocations and subgrain boundaries consisting of dislocation arrays. These experimental results indicate that dynamic recovery and recrystallization play an important role in the high-strain-rate deformation process.

基金信息:the National Natural Science Foundation of China

有色金属在线官网  |   会议  |   在线投稿  |   购买纸书  |   科技图书馆

中南大学出版社 技术支持 版权声明   电话:0731-88830515 88830516   传真:0731-88710482   Email:administrator@cnnmol.com

互联网出版许可证:(署)网出证(京)字第342号   京ICP备17050991号-6      京公网安备11010802042557号