简介概要

FINITE ELEMENT COMPUTER MODEL OF MICROWAVE HEATED CERAMICS

来源期刊:Journal Of Wuhan University Of Technology Materials Science Edition1995年第2期

论文作者:周立秋 刘钢 程吉平 周健

文章页码:27 - 33

摘    要:<正>At present,the concerned papers appeared in special maga-zines abcout discussing or introducing finite element method for calcu-lating temperature distribution in ceramic body during microwave sin-tering,are not a good many,but it seems that finite element method ismore convenient than finite difference method in dealing with specialor complex geometry of ceramic body.In this paper,we describe a 3D finite element model simulatingthe heating pattern of ceramic microwave sintering in TE10Nsingle-mode rectangular cavity in which the microwave energy deposition pat-tern in the samples can be expressed as an analysis function of space,and present a series of transient temperature distributions and heatingrates of ceramic cylinders and cuboids under variable thermal conduc-tivities,dieletric loss factors,power consumer levels,etc.These digitalsolutions may provide a better understanding of eliminating thermalrunaway and improving temperature homogeneity.

详情信息展示

FINITE ELEMENT COMPUTER MODEL OF MICROWAVE HEATED CERAMICS

周立秋,刘钢,程吉平,周健

摘 要:<正>At present,the concerned papers appeared in special maga-zines abcout discussing or introducing finite element method for calcu-lating temperature distribution in ceramic body during microwave sin-tering,are not a good many,but it seems that finite element method ismore convenient than finite difference method in dealing with specialor complex geometry of ceramic body.In this paper,we describe a 3D finite element model simulatingthe heating pattern of ceramic microwave sintering in TE10Nsingle-mode rectangular cavity in which the microwave energy deposition pat-tern in the samples can be expressed as an analysis function of space,and present a series of transient temperature distributions and heatingrates of ceramic cylinders and cuboids under variable thermal conduc-tivities,dieletric loss factors,power consumer levels,etc.These digitalsolutions may provide a better understanding of eliminating thermalrunaway and improving temperature homogeneity.

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