Modification of residual stress in Al-£ÛAlBO£Ý_w/Al compound plate

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ÎÄÕÂÒ³Â룺275 - 277

Key words£ºAl-£ÛAlBO£Ý_w/Al; compound plate; residual stress

Abstract: The application of compound parts of Al-£ÛAlBO£Ý_w/Al not only reduces the cost of the parts but also improves its properties. However, there is a large thermal residual stress between Al and £ÛAlBO£Ý_w/Al, and it is harmful for practical application. From the theoretical analyses and experimental results, it was found that by the compressive preª²plastic deformation perpendicular to the interface between Al and £ÛAlBO£Ý_w/Al, the interlayer residual stress of compound parts can be reduced, while the mechanical properties of compound parts can be improved.