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Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system MENG Gong-ge(孟工戈)1, T. Takemoto2, H. Nishikawa2 1. College of Materials Science and Engineering, Harbin... content, soldering temperature and time on the IMC thickness in Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.2Co alloys were researched using uniform design method and computer programs. For each alloy, the factors......
is, the thicker the IMC layer forms. While soldering at the same temperature, with the increase of Cu content the thickness of IMC reduces first then increases. The thickness of IMC increases... Variational curves of IMC thickness of Sn-xCu/Cu joints vs content of copper at different temperatures 图4 260℃ 钎焊60s反应产物的X射线衍射谱 Fig.4 XRD patterns for reaction products at 260......
method of IMC layer of interface and Ni layer thickness 2 结果与分析 2.1 SAC305/Ni焊点的界面反应行为 在不同焊接工艺条件下,镀Ni层中Ni元素的扩散速率不仅影响镀Ni层的消耗,同时也影响界面IMC微观组织的演变.图3所示为在260 ℃下,SAC305/Ni焊点在不同的液态停留时间下的微观组织.当液态停留时间...率降低.为了进一步定量描述其界面IMC的生长规律,测量了不同液态保温时间下的界面IMC层厚度,如表1所列. 表1 不同液态停留时间下IMC层厚度及镀Ni层厚度 Table 1 IMC thickness and Ni layer thickness at different holding time 界面IMC层厚度与停留时间的生长数值模型可用关系方程表示为  ......
thin thickness after aged. The IMC growth rate of SAC305 is 2.17×10-5 μm2/s. However, the IMC growth rate of LASAC solder is 3.8×10-5 μm2/s, which is faster than that of SAC305. The growth rate of IMC...方根的曲线(见图5).在180 ℃等温时效时,随时效时间的增加,4种成分钎料焊点IMC厚度都在不断增加,但增加的速度有所不同,即界面化合物层的厚度与时效时间平方根之间近似满足线性关系.这表明时效过程中界面金属间化合物层厚度的增加是受元素扩散控制的[15-16]. 图5 IMC厚度与t1/2的变化关系曲线 Fig. 5 IMC thickness versus square......
microstructure and needle-like (Ni,Au)3Sn2 intermetallics are formed at the AuSn20/Ni joint after reflow at 300 ℃ for 90 s. After aging at 150 ℃ for various times,the thickness of the IMC layer at AuSn20/Ni... interface is faster than that when aging at 150 ℃. The thickness of the IMC layer grows rapidly with increasing the aging time while the shear strength of the joints declines almost lightly. Considering......
都遵循抛物线生长规律,即IMC的生长行为受扩散过程控制[17-19]. 图6 IMC总厚度与时效时间的平方根的关系 Fig.6 Thickness of intermetallic compound layer as function of square root of aging time 为了进一步了解Sn-0.7Cu-0.5Ni-xCe(x=0,0.1...文章编号:1004-0609(2007)03-0390-06 添加0.10%Ce对Sn-0.7Cu-0.5Ni焊料与Cu基板间界面IMC的影响 卢 斌,王娟辉,栗 慧,朱华伟,焦宪贺 (中南大学 材料科学与工程学院,长沙 410083) 摘 要:研究Sn-0.7Cu-0.5Ni-xCe(x=0,0.1)焊料与铜基板间543 K钎焊以及453 K恒温时效......
, the thickness l of the IMC layers monotonically increase with increasing aging time t according to the relationship l=k(t/t0)n for both type joints. Aged at 160 ℃ and 200 ℃, the grain boundary diffusion...DOI: 10.11817/j.issn.1672-7207.2019.04.009 Au-Sn焊点异质界面的耦合反应及其对力学性能的影响 朱学卫1,韦小凤1,黄玉祥1,卫启哲1,程小利2 (1. 西北农林科技大学 机械与电子工程学院,陕西 杨凌,712100; 2. 重庆材料研究院有限公司,重庆,400707) 摘要:为了探讨Au-Sn异质焊点耦合界面反应对界面IMC层生长行为及焊点力学性能的......
to the formation of IMC, and the hole shape (CuxNi1-x)6Sn5 forms in the soldering interface. With low-temperature soldering process, the fitting line of the IMC thickness and aging time is totally...时效时间延长,添加Ni颗粒后IMC的致密性明显提高,钎料中元素的互扩散系数明显降低,IMC层厚度没有出现明显的增长. 图6 150℃时效时IMC厚度与的关系 Fig. 6 Relationship between IMC thickness and square root of aging time after aging at 150 ℃ 图7 125......
Sn2.5Ag0.7Cu0.1RExNi/Cu(x=0, 0.05, 0.1, %)接头界面粗糙度及IMC层的平均厚度 Fig. 5 Roughness and IMC average thickness of Sn2.5Ag0.7Cu0.1RExNi/Cu (x=0, 0.05, 0.1, %) solder joint interface in different thermal cycling... substrate. The morphology of the IMC in soldered joints transfers from wavy-shape into larger bamboo shoots with the increasing of thermal cycling, which causes increase of roughness and thickness......
J. Cent. South Univ. Technol. (2011) 18: 1813-1818 DOI: 10.1007/s11771-011-0907-z Characteristics of thickness distribution of tailor-welded tube hydroforming CHU Guan-nan(初冠南)1, 2, LIU Gang(刘钢)3... Berlin Heidelberg 2011 Abstract: Both experimental and mechanical analyses were carried out to investigate the characteristics of thickness distribution for tailor-welded tube (TWT) hydroforming......