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Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate TIAN Yan-hong(田艳红)1, WANG Chun-qing(王春青)1, Y. Norman ZHOU2 1. State Key Laboratory of Advanced Welding...; Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated......
Relaxations and bonding mechanism of arsenic in-situ impurities in MCT: first-principles study Sun Li-zhong(孙立忠)1, 2, Zhong Xiang-li(钟向丽)1, Wang Jin-bin(王金斌)1, Chen Xiao-shuang(陈效双... with the experimental results. Key words: Hg1-xCdxTe; arsenic impurity; atom relaxation; bonding mechanism; first-principle study 1 Introduction Mercury cadmium telluride (Hg1-xCdxTe, MCT) is currently one......
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J. Cent. South Univ. Technol. (2011) 18: 953-959 DOI: 10.1007/s11771-011-0786-3 Bonding mechanism of X10CrNi18-8 with Ni/Al2O3 composite ceramic by pressureless infiltration YANG Shao-feng(杨少锋... are (FexAly)3O4 intermetallic phase and (AlxCry)2O3 solid solution. The interfacial bonding strength is as high as about 67.5 MPa. The bonding mechanism of X10CrNi18-8 steel with the composite ceramic......
packaging industry, while the mechanism of ultrasonic bonding has not been understood very well. Harman[1] observed that the peeling underdeveloped bonds simulate a torus (or doughnut) with an unbonded... but in basis material or weak places. References [1] Harman G G. The ultrasonic welding mechanism as applied to aluminum- and gold-wire bonding in microelectronics[J]. IEEE Transactions on Packaging......
temperature or lower temperature[1-5]. Although it has been applied in integrated circuit(IC) industry for decades, its mechanism has not been understood very well. People only know that the bonding strength... Effect of ultrasonic power on wedge bonding strength and interface microstructure WANG Fu-liang(王福亮), LI Jun-hui(李军辉), HAN Lei(韩 雷), ZHONG Jue(钟 掘) School of Mechanical and Electrical......
. [10] HE P, LIU D. Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials [J]. Materials Science and Engineering A, 2006, 437... Bonding interface zone of Mg-Gd-Y/Mg-Zn-Gd laminated composite fabricated by equal channel angular extrusion WU Di(吴 迪)1, 2, CHEN Rong-shi(陈荣石)1, HAN En-hou(韩恩厚)1 1. State Key Laboratory......
SUPERPLASTICITY AND DIFFUSION BONDING OF IN718 SUPERALLOY K.F. Zhang1,D.Z. Wu1,W.B. Han1,B. Wang1 (1.School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China) Abstract:The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial......
Detailed Evolution Mechanism of Interfacial Void Morphology in Diffusion BondingChao Zhang,Hong Li,Miaoquan LiSchool of Materials Science and Engineering, Northwestern Polytechnical University摘 要:Similar diffusion bonding of 1Cr11Ni2W2MoV stainless steel was conducted at different bonding temperatures. The interface characteristics and mechanical......
