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Trans. Nonferrous Met. Soc. China 20(2010) s988-s992 Preparation of SiCp/A356 electronic packaging materials and its thixo-forging WANG Kai-kun(王开坤), KANG Yong-lin(康永林), SONG...; accepted 15 July 2010 Abstract: The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum......
Microstructure and electric properties of Sip/Al composites for electronic packaging applications XIU Zi-yang(修子扬), WU Gao-hui(武高辉), ZHANG Qiang(张 强), SONG Mei-hui(宋美慧), TIAN Shou-fu... environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, particle volume......
Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites WANG Kai-kun(王开坤) 1, WANG Fu-yu(汪富玉)1, CHEN Xue-jun(陈学军)2, WANG Lu(王 璐)2, MA Chun-mei(马春梅)1 1. School... 13 May 2010; accepted 25 June 2010 Abstract: Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process......
Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging WANG Xiao-feng(王小锋)1, 2, WU Gao-hui(武高辉)2, WANG Ri-chu(王日初)1, XIU Zi-yang(修子扬)2, YU Kun(余 ..., China Received 15 July 2007; accepted 10 September 2007 Abstract: In order to improve the thermal properties of MMCs for electronic packaging, the concept of fabrication MMCs with particular......
Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoformingGUO Ming-hai(郭明海), LIU Jun-you(刘俊友), JIA Cheng-chang(贾成厂), JIA Qi-jin(贾琪瑾), GUO Shi-ju(果世驹) (School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China)Abstract:The electronic packaging shell with high......
composites; pressureless infiltration; kinetics; electronic packaging CLC number: TB333 Document code: A electronic packaging and thermal management[1]. Electronic packaging materials are required to possess compatible CTEs with the IC, thus the composites with high volume fraction......
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper compositesKai-Kun WangSchool of Materials Science and Engineering,University of Science and Technology Beijing摘 要:To fabricate electronic packaging shell of copper-matrix composite with characteristics of high thermal conductivity and low thermal expansion coefficient......
Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications CHEN Guo-qin(陈国钦)1, XIU Zi-yang(修子扬)2, MENG Song-he(孟松鹤)3, WU Gao-hui(武高辉)1, ZHU... reinforcement content (φp=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB2p/Cu composites were......
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Trans. Nonferrous Met. Soc. China 25(2015) 1995-2002 Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy Dan...) (as-tested) and a CTE of 10.79×10-6 /K (20-100 °C). Key words: electronic packaging material; Cu/Invar composite; rolling; annealing 1 Introduction In recent years, with the development of high......
