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utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior... and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. Key words: lead-free solder; Sn-Ag-Cu alloy; rare earth element; La; tensile properties 1 Introduction Increasing......
is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %. Key words: Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical... Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys ZHAO Xiao-yan(赵小艳), ZHAO Mai-qun(赵麦群), CUI Xiao-qing(崔小清), XU Tian-han(许天旱), TONG Ming-xin......
; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新... vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively......
IR reflow soldering method. Key words: diode-laser soldering; Sn-Ag-Cu lead-free solder; shear force; microstructure 1 Introduction With low cost, Sn-Pb alloy has been widely used in electronic... and the environment, and recent concerns over the toxicity of Sn-Pb solder alloy result in the development of new lead-free solder alloys for electronic packaging[1,2]. Among several lead-free candidate......
℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1  ...;EXPERIMENTAL 2.1 Materials The base metal for testing was pure copper. The lead-free solder was Sn-Ag-Cu-Ce alloy which was composed of 3.5%Ag, 1.0%Cu, 94.0%Sn, 0.05%Ce and 0.5%(mass fraction......
Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloyHui-zhen Huang,Xiu-qin Wei,Dun-qiang Tan,Lang ZhouSchool of Materials Science and Engineering, Nanchang University摘 要:This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior......
are regarded as the most potential lead-free solder system in the electronics. For an actual replacement for the lead-containing solder, reliability of their solder interconnections, which is mainly...]. Microelectronics International, 1998, 15: 20-24. [14] ZENG K,Vuorinen V, Kivilahti J K. Interfacial reactions between lead-free SnAgCu solder and Ni(p) surface finish on printed circuit boards[J......
solder alloys, the value of the total resistance increases with the increase of cobalt content. This indicates that the Co-containing alloys have higher corrosion resistance than the cobalt free alloy... current density of the extruded Sn-9Zn-0.5Co alloy is only 1/10 of the cobalt free alloy. Therefore, the corrosion rate of the Sn-Zn-0.5Co solder alloy is remarkably lower than that of the cobalt free alloy......
conditions. Key words: lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability  ... of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress-strain curves were compared......
. Keywords: lead-free solder; Sn-3.5%Ag solder; eutectic reaction; intermetallic compounds; microhardness... on the environmental protection and health hazards of Sn-Pb solders used in electronic packaging have prompted the development for lead-free solder alternatives in electronic industry[1–3......