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Effect of ultrasonic power on wedge bonding strength and interface microstructure WANG Fu-liang(王福亮), LI Jun-hui(李军辉), HAN Lei(韩 雷), ZHONG Jue(钟 掘) School of Mechanical and Electrical...; Abstract: During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based......
; Abstract: The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also......
interface but in basis material, and the bonded strength at interface is enhanced by diffused atom from the other side. Key words: thermosonic bond; atomic diffusion; dimples, bonding strength  ... Atomic diffusion properties in wire bonding LI Jun-hui(李军辉), WANG Fu-liang(王福亮), HAN Lei(韩 雷), DUAN Ji-an(段吉安), ZHONG Jue(钟 掘) College of Mechanical-Electronical Engineering, Central South......
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the Mg-5Gd-5Y/Mg-2Zn-1Gd (GW55/ZG21) laminated composites. After fabrication and annealing treatment, the microstructural evolution, phase constitution, microhardness, and bonding strength were...)5 phases on GW55 side decrease, and PFZ is broadened. Meanwhile, the hardness on the bonding interface zone decreases and the bonding strength increases from 126 MPa to 162 MPa. Key words: magnesium......
strength. With increasing bonding temperature and time, ((Al)+θ) mixture separates out from Al alloy, and (Cu)+ γ1)mixture separates out from Cu layer. The two kinds of mixtures develop first along.... The two kinds of changes result in reducing bonding strength greatly. The optimum diffusion bonding parameters are determined as follows: T=773K, t=1226s and p=6MPa, at which the tensile strength......