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of Nonferrous Metals, Guangzhou 510651, China) Abstract: The growth behavior of interfacial intermetallic compounds (IMCs) of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate... and Sn-9Zn/Cu-substrate, simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate. It is also shown that the addition of Cu-particles in Sn-9Zn......
Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging徐涛1,胡小武1,2,LI Yulong1,JIANG Xiongxin1,YU Xiao11. Key Lab for Robot... id="ChDivSummary" name="ChDivSummary">The formation and growth behavior of intermetallic compound(IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu(SAC305......
DOI:10.19476/j.ysxb.1004.0609.2019.04.13 超声波作用下Cu/Sn固-液界面IMCs层的形成与演变 俞伟元1, 2,刘英宗1,吴炜杰1,李富祥1,邢春晓1 (1. 兰州理工大学 甘肃省有色金属新材料省部共建国家重点实验室,兰州 730050； 2. 兰州理工大学 有色金属合金及加工教育部重点实验室,兰州 730050) 摘 要:利用超声波辅助钎焊工艺方法对Cu/Sn/Cu结构进行钎焊实验,研究超声波辅助作用下Cu/Sn固-液界面金属间化合物(IMCs)的形成与演变过程.结果表明:无超声作用时界面处Cu-Sn金属间化合物形貌逐渐由平直状转变为凹凸的扇贝状,其中Cu6Sn5的形成主要受扩散控制,而Cu3Sn层的形成则是由反应控制.施加超声波后,通过观察不同超声条件下Cu-Sn金属间化合物形貌的微观结构演变,提出破碎-溶解模型.通过改变超声时间......
铜/铝复合板界面IMCs的生长速率 Table 2 Growth rates of interfacial IMCs for Cu/Al clad sheet 图6 IMCs生长速率的Arrehenius曲线 Fig. 6 Arrhenius plots of IMCs growth rate 基于各层IMCs数据,利用式(1)和式(2),可得出铜... by different heat treatment processes. The interfacial intermetallic compounds (IMCs) component, structure and growth law were investigated by scanning electron microscopy (SEM), EBSD and X-Ray......
, the dissimilar joints between Ti and stainless steel were dominated by the Ti-based intermetallic compounds (IMCs), e.g. (Ti, Zr)2(Fe, Ni), TiFe, TiCu, and Ti2(Fe, Ni), due to a significant dissolution... and the base metal is necessary to prevent the brittleness of the joint. Key words: brazing; titanium; stainless steel; intermetallic compounds (IMCs) 1 Introduction The utilization of costly......
of this paper is to study the effect of low growth rate on the phase and its morphologies of Ti-45%Al(molar fraction) alloy. With experimental measurement of temperature history of a given point of the TiAl.... 3 RUSULTS 3.1 Temperature gradient Fig.1 shows the temperature history of the measured point in the Ti-45%Al alloy during DS process at the growth rates of 1.67×10-5m/s and 2.50×10-5m/s......
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of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin 15000,China摘 要:The growth of Au-Sn intermetallic compounds(IMCs) is a major... paper presented the growth behavior of Au-Sn IMCs at interfaces of Au metallization and Sn-based solder joints with the addition of Cu alloying element during aging process,and growth coefficients......
Ⅱ to the present;details the development of this issue in the electronics-rich systems including the phenomenon,problems and remedies;pictures the long history of the developments of the growth mechanisms...Spontaneous Growth of Metal Whiskers on Surfaces of Solids:A ReviewPeigen Zhang1,Yamei Zhang2,Zhengming Sun1,2,31. Jiangsu Key Laboratory of Advanced Metallic Materials,School of Materials Science......
stress history LIANG Fa-yun(梁发云)1, CAO Ping(曹平)1, QIN Hong-yu(秦红玉)2 1. Department of Geotechnical Engineering, Tongji University, Shanghai 200092, China; 2. College of Science and Engineering, Flinders... of pile but neglected the difference of dynamic characteristics before and after construction, and potential changes in stress history of remaining soil are also ignored. In this work, a calculation model......
