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and Engineering A, 2003, 358(1-2): 134-141. [12]Suganuma K. Low Temperature Lead-Free Soldering JIEP Project (SnZnBi etc)[A]. Proceedings of International Conference on Lead Free Electronics "Towards......
Trans. Nonferrous Met. Soc. China 30(2020) 2293-2310 Liquid-liquid structure transition in metallic melt and its impact on solidification: A review Yi-xuan HE1,2, Jin-shan LI1, Jun WANG1, Eric BEAUGNON2 1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’a......
- 0.5Cu0.2La无铅钎料,其润湿角为25.1°,发现La和合金元素Ga的含量对SnZnBi系无铅钎料的润湿性能有较大影响. 2.2 力学性能 在集成电路中,焊点在服役期间即承担电子器件与基板之间的电气连接,也承担着一定的机械支撑作用[87].因此,在实际的使用中,无铅钎料必须具备较高的力学性能才能保证焊点的机械支撑作用.目前,针对无铅钎料的力学性能测试主要集中在拉伸,剪切和压缩3......