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polishing 超大规模集成电路(ULSI)正朝集成度提高,特征尺寸减少,互连线层数增多等方向发展,对化学机械抛光(Chemical mechanical..., 2008, 18(1): 178?182. [3] WANG Liang-yong, ZHANG Kai-liang, SONG Zhi-tang, FENG Song-lin. Ceria concentration effect on chemical mechanical polishing of optical glass[J]. Applied Surface Science......
water-free slurry applying for CLBO crystal chemical mechanical polishing(CMP) was investigated. The abrasive is SiO2. The influence of polishing processing parameter on polishing process for CLBO... crystal; water-free slurry; chemical mechanical polishing 1 Introduction CsLiB6O10(CLBO) is a new-type nonlinear optical crystal, which was found in 1990s[1,2]. CLBO has many good performances......
CeO2 were studied by polarization curve technologies. The dependence of the polishing rate on the pH and the concentration of CeO2 in slurries during chemical mechanical polishing(CMP) were also... theoretic guidance on silicon polishing rate and ensure to adjust optimal components of slurry. Key words: Chemical mechanical polishing(CMP); material removal rate(MRR); electrochemical......
Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire孔慧1,2,WANG Dan1,刘卫丽1,SONG Zhitang11. State Key Laboratory of Functional...) and the Focus Ion Beam(FIB) system. This kind of novel colloidal silica particles can be well used in chemical mechanical polishing(CMP) of sapphire wafer surface. And the polishing test proves that non......
Magnetic force improvement and parameter optimization for magnetic abrasive polishing of AZ31 magnesium alloy S. O. KIM1, J. S. KWAK2 1. Graduate School of Mechanical Engineering... lower polishing efficiency. The magnesium alloy that has superior mechanical properties for industrial application such as a lightweight and high specific strength is one of the most famous nonferrous......
Electrolyte composition and galvanic corrosion for ruthenium/copper electrochemical mechanical polishingYan-Fei Bian1,Wen-Jie Zhai1,Yuan-Yuan Cheng2,Bao-Quan Zhu11. School of Mechatronics Engineering, Harbin Institute of Technology2. School of Civil Engineering, Harbin Institute of Technology摘 要:Electrochemical mechanical polishing(ECMP)is a new......
; 文献标志码:A 根据国际半导体技术发展路线图(International technology roadmap for semiconductors, ITRS)2014版的预测,超大规模集成电路还将延续Moore定律迅速发展.伴随集成度的提高,特征尺寸的减小以及各种新材料,新工艺的不断涌现,对化学机械抛光/平坦化(Chemical mechanical polishing...-chun. Chemical mechanical polishing: theory and experiment[J]. Friction, 2013, 1(4): 306-326. [3] DUBOIS C, SYLVESTRE A, CHAABOUNI H, FARCY A. Impact of the CMP process on the electrical properties......
for chemical mechanical polishing (CMP) of silicon dioxide dielectric layer. The morphologies of the dielectric layer after polishing by the composite abrasives were investigated by AFM. The results indicate... μm ×10 μm are 0.372 and 0.470 nm, respectively. Key words: PS-CeO2 composite abrasives; core-shell structure; chemical mechanical polishing (CMP) CeO2是一种重要的稀土氧化物,虽然它较软(莫氏硬度为6~7),但一直被用于有效地抛光高硬度的玻璃基板......
; 1 Introduction The chemical mechanical polishing (CMP) process has... [1] SEO Y J, PARK S W, KIM C B. Global planarization characteristics of shallow trench isolation-chemical mechanical polishing process with and without reverse moat etch step[J]. Journal......