共搜索到79999条信息，每页显示10条信息，共8000页。用时：0小时0分1秒562毫秒
Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate TIAN Yan-hong(田艳红)1, WANG Chun-qing(王春青)1, Y. Norman ZHOU2 1. State Key Laboratory of Advanced Welding...; Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated......
as follows: the diameter of gold wire was 25 μm, substrate size was 25 mm×12 mm, and substrate material copper was sputtered by Ag. The bonding parameters are listed in Table 1. The bonding... Temperature effect in thermosonic wire bonding WU Yun-xin(吴运新), LONG Zhi-li(隆志力), HAN Lei(韩 雷), ZHONG Jue(钟 掘) School of Electromechanical Engineering, Central South University, Changsha 410083......
. The experimental conditions are listed in Table 3. Nitrogen pressure was varied in the range of 10-100 kPa. The vaporization energy of copper wire with 0.1 mm in diameter and 25 mm in length... measurement of PWD by infrared thermometer Figs.6 and 7 show such voltage/current waveforms and framing photographs of the expanding plasma in explosion of copper wire. It was found that the current became......
): 1373-1376. [7] HUNG Fei-yi, LUI Truan-sheng, CHEN Li-hui, LIN Yi-chang. Electric flame-off characteristics and fracture properties of 20 μm thin copper bonding wire[J]. Materials Transactions, 2009, 50(20): 293-298. [8] HUNG Fei-yi, WANG Yuan-tin, CHEN Li-hui, LUI Truan-sheng. Recrystallization effect and electric flame-off characteristic of thin copper wire[J]. Materials Transactions, 2006, 47(7......
J. Cent. South Univ. (2019) 26: 604-611 DOI: https://doi.org/10.1007/s11771-019-4031-9 Effect of wire mesh interlayer in explosive cladding of dissimilar grade aluminum plates SARAVANAN S1... GmbH Germany, part of Springer Nature 2019 Abstract: Explosive cladding of Al 5052–Al 1100 plate, interfaced with a stainless steel wire mesh interlayer, is attempted. Loading ratio and standoff distance......
......
......
) [5] YEA Yang-su. Enhanced boundary lubrication by potential control during copper wire drawing[J]. Wear, 1997, 210: 165-170. [6] WU C W, HSU R Q. Theoretical analysis of extrusion of rectangular... Wear behaviors and lubrication medium of TiC/Al2O3 ceramic wire drawing dies YANG Xue-feng(杨学锋)1, DENG Jian-xin(邓建新) 2, WANG Hui(王 慧)1, ZE Xiang-bo(昃向博)1 1. Department of Mechanical......
at interface was observed with scanning electron microscope. 2 Experimental Nickel-pad plated on a copper plate was bonded using 500 μm diameter-aluminum wire and LW500 wedge capillary on a U3000... Atomic diffusion properties in wire bonding LI Jun-hui(李军辉), WANG Fu-liang(王福亮), HAN Lei(韩 雷), DUAN Ji-an(段吉安), ZHONG Jue(钟 掘) College of Mechanical-Electronical Engineering, Central South......
material with other plastic material, such as aluminum-clad copper wire[9-10], little has been reported on the theory of coating a kind of brittle material with plastic material. The Pb-GF composite wire... Effect of extrusion ratio on coating extrusion of Pb-GF composite wire by numerical simulation and experimental investigation WANG Xin(王 欣), SUN Hong-fei(孙宏飞), FANG Wen-bin(房文斌) School......
