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, China Received 12 March 2006; accepted 22 August 2006 Abstract: Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force......
Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology HAN Zong-jie(韩宗杰)1, XUE Song-bai(薛松柏)1, WANG Jian-xin(王俭辛)1, ZHANG Xin(张 昕)1... carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also......
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Soldering of Zr-based bulk metallic glass and copper by Au-12Ge eutectic alloyJun Wang,Jing Cui,Hong-Chao Kou,Heng Guan,Jin-Shan LiState Key Laboratory of Solidification Processing, Northwestern...-based metallic glass of 18 μm is shown to be the best for the soldering, while the surface roughness has a weak effect on the soldering behavior of Au-12 Ge solder on copper. After soldering, long-range......
Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal AgingNing Zhao, Haitao Ma, Haiping Xie and Lai Wang School of Materials Science and Engineering... microstructure in (Sn-9Zn)-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-9Zn solder on Ni substrate was markedly improved by adding 2 wt pct Cu......
Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in AirZhi-Wei Lai1,2,3,Zhe-Yuan Huang2,4,Chuan Pan3,Hui-Qiao Du5,Xiao-Guang...-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa......
Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging徐涛1,胡小武1,2,LI Yulong1,JIANG Xiongxin1,YU Xiao11. Key Lab for Robot...) solder joint during soldering and aging were investigated. The soldering was performed at 250 ℃ for 10 min, followed by air cooling and aging treatment at 150 ℃ up to 15 days. The results show......
="ChDivSummary" name="ChDivSummary">A data-driven approach combining together the experimental laser soldering,finite element analysis and machine learning,has been utilized to predict the morphology... of forming prismatic interfacial IMC during laser soldering,can be inferred as most suitable SAC solders in applications exposed to shear loads.关键词:......
Trans. Nonferrous Met. Soc. China 28(2018) 748-756 Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder L. C. TSAO1, S. Y. CHANG2, Y. C. YU1 1... and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering (DAS) in air with Sn3.5Ag4Ti active filler at 250 °C for 60 s. The results showed that the diffusion......