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; accepted 15 July 2010 Abstract: The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum...Trans. Nonferrous Met. Soc. China 20(2010) s988-s992 Preparation of SiCp/A356 electronic packaging materials and its thixo-forging WANG Kai-kun(王开坤), KANG Yong-lin(康永林), SONG......
. [9] WU Gao-hui, XIU Zi-yang, SUN Dong-li, ZHANG Qiang, SONG Mei-hui. Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications[J]. Material Science... Microstructure and electric properties of Sip/Al composites for electronic packaging applications XIU Zi-yang(修子扬), WU Gao-hui(武高辉), ZHANG Qiang(张 强), SONG Mei-hui(宋美慧), TIAN Shou-fu......
properties of Ni-P electroless plated SiCp/Al composite electronic packaging material [J]. Surface & Coatings Technology, 2008, 202: 2540-2544. [6] CHINE C W, LEE S L, LIN J C, JAHN M T. Effects of Sip... Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites WANG Kai-kun(王开坤) 1, WANG Fu-yu(汪富玉)1, CHEN Xue-jun(陈学军)2, WANG Lu(王 璐)2, MA Chun-mei(马春梅)1 1. School......
Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging WANG Xiao-feng(王小锋)1, 2, WU Gao-hui(武高辉)2, WANG Ri-chu(王日初)1, XIU Zi-yang(修子扬)2, YU Kun(余 ..., China Received 15 July 2007; accepted 10 September 2007 Abstract: In order to improve the thermal properties of MMCs for electronic packaging, the concept of fabrication MMCs with particular......
Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications CHEN Guo-qin(陈国钦)1, XIU Zi-yang(修子扬)2, MENG Song-he(孟松鹤)3, WU Gao-hui(武高辉)1, ZHU... reinforcement content (φp=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB2p/Cu composites were......
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) (as-tested) and a CTE of 10.79×10-6 /K (20-100 °C). Key words: electronic packaging material; Cu/Invar composite; rolling; annealing 1 Introduction In recent years, with the development of high...Trans. Nonferrous Met. Soc. China 25(2015) 1995-2002 Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy Dan......
Trans. Nonferrous Met. Soc. China 22(2012) 1686-1692 Microstructure and properties of Al/Si/SiC composites for electronic packaging ZHU Xiao-min, YU Jia-kang, WANG Xin-yu State Key Laboratory... for electronic packaging were fabricated by gas pressure infiltration. On the premise of keeping the machinability of the composites, the silicon carbide particles, which have the similar size with silicon......
="ChDivSummary">Silicon/aluminum(Si/Al) composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites...Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy techniqueYan-Qiang Liu,Jian-Zhong Fan,Xin-Xiang Hao,Shao-Hua Wei,Jun-Hui Nie,Zi-Li......
bonding process for ceramic MEMS packaging was investigated. This process has been demonstrated for CQFP packaging in our previous research [12]. In this paper, the material system was extended... of laser power density and the scanning speed on the packaging temperature. Fig.1 illustrates the thermal model for heat transfer analysis of 4 mm×4 mm ceramic packages. Packaging material properties......
