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J. Cent. South Univ. (2021) 28: 2436-2450 DOI: https://doi.org/10.1007/s11771-021-4778-7 Wafer bin map inspection based on DenseNet YU Nai-gong(于乃功)1, 2, 3, XU Qiao(徐乔)1, 2, 3, WANG Hong-lu(王宏陆)1... Nature 2021 Abstract: Wafer bin map (WBM) inspection is a critical approach for evaluating the semiconductor manufacturing process. An excellent inspection algorithm can improve the production......
Electrochemical behavior and polishing properties of silicon wafer in alkaline slurry with abrasive CeO2 SONG Xiao-lan(宋晓岚)1, XU Da-yu(徐大余)1, ZHANG Xiao-wei(张晓伟)1, SHI Xun-da(史训达)2, JIANG Nan(江 楠)1, QIU Guan-zhou(邱冠周)1 1. Department of Inorganic Materials, School of Resources Processing and Bioengineering, Central South University, Changsha 410083, China; 2. Silicon Wafer Manufacture......
sputtering onto unheated silicon wafer substrates in Ar gas at 0.3Pa. The base pressure in the deposition system was of the order 10-4Pa, r.f. power was 200W and the substrate-target distance was about... as-deposited one because of good cohesion between film and Si wafer. REFERENCES [1]Otsuka K, REN Xiao-bing. Recent developments in the research of shape memory alloys [J]. Intermetallics, 1999, 7(5......
Effect of Rapid Thermal Process on Oxygen Precipitates in Heavily Sb-Doped Silicon Wafer Xu Yuesheng1,Hao Qiuyan1,Teng Xiaoyun1,Liu Caichi1,Zhao Liwei1,Sun Shilong1 (1.Institute of Information.... The experiment results show that high density of oxygen precipitates is observed in heavily Sb-doped wafer. It is found that the oxygen precipitates in heavily Sb-doped silicon are enhanced at high cooling rate......
improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level.Key words:silicon wafer; thermal transport properties...Effects of thermal transport properties on temperature distribution within silicon waferWANG Ai-hua(王爱华)1, NIU Yi-hong(牛义红)1, CHEN Tie-jun(陈铁军)1, P. F. HSU2(1. School of Materials and Metallurgy......
the wafer plane. But with its plastic reshape, the microstructure can be created outside the wafer. On the other hand, silicon forming needs furnace heating the whole wafer to the ductile temperature... were performed with the single-sided polished (110) wafer of silicon. Nd:YAG laser (1.064 μm) was used in welding mode with a single pulse energy of 0.04 J, pulse width of 2 ms, output frequency of 30......
Photolithography process A photolithography process is the process of transferring geometric shapes on a mask to the surface of a silicon wafer[16]. The basic photolithographic sequence is shown... process in semiconductor wafer fabrication systems using extended hybrid Petri nets ZHOU Bing-hai(周炳海), PAN Qing-zhi(潘青枝), WANG Shi-jin(王世进), WU Bin(吴 斌) (School of Mechanical Engineering, Shanghai......
on silicon substrates. Trench-patterned silicon substrate with square rectangle and ‘SE’ letter shape were employed. To mount catalyst only on the bottom of the trenches, catalyst precursor solution... grown on trench-patterned silicon substrates: (a) Square shape; (b) Rectangle shape. The CNTs have diameters in the range of 20-30 nm. Fig.1 represents the top-view SEM images, showing that the CNTs......
Investigation on Adsorption State of Surface Adsorbate on Silicon Wafer刘玉岭,刘纳,曹阳摘 要:1IntroductionTheminimalfeaturesizeonthemicroelectronicdeviceshadbendevelopedtolesthan0.35μm.Thisvaluewilchangeto0.05μminnex...关键词:......
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