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; 2. Yik Shing Tat Industrial Co., Ltd., Shenzhen 518101, China) Abstract: Sn-Ag-Cu series alloy is considered as the lead-free alternative to lead-tin alloys. A new method was introduced to measure...文章编号: 1004-0609(2005)05-0688-06 微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能 王凤江1, 钱乙余1, 马 鑫2 (1. 哈尔滨工业大学 现代焊接生产技术国家重点实验室, 哈尔滨 150001; 2. 深圳市亿铖达工业有限公司, 深圳 518101) 摘 要: Sn-Ag-Cu系合金是最有可能替代Sn-Pb钎料的无铅钎料. 介绍......
文章编号:1004-0609(2008)09-1651-07 La对Sn-Ag-Cu无铅钎料与铜钎焊接头金属间化合物的影响 周迎春,潘清林,李文斌,梁文杰,何运斌,李运春,路聪阁 (中南大学 材料科学与工程学院,长沙 410083) 摘 要:研究微量稀土La在钎焊和时效过程中对Sn-3.0Ag-0.5Cu无铅钎料与铜基板的钎焊界面及钎料内部金属间化合物(IMC)的形成与生长行...后钎料内部Ag仍以共晶形式存在,时效后Ag3Sn颗粒沿钎料内部的共晶组织网络析出. 关键词:Sn-Ag-Cu无铅钎料；La；钎焊；时效；金属间化合物 中图分类号:TG 425.1 文献标识码:A Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free......
and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. Key words: lead-free solder; Sn-Ag-Cu alloy; rare earth element; La; tensile properties 1 Introduction Increasing... temperatures, good workability, and excellent wetting property. The Sn-Ag-Cu ternary alloys were considered as one of the most promising candidates for substituting the Sn-Pb solder alloy in microelectronic......
IR reflow soldering method. Key words: diode-laser soldering; Sn-Ag-Cu lead-free solder; shear force; microstructure 1 Introduction With low cost, Sn-Pb alloy has been widely used in electronic... alloys, which have been researched and developed, the Sn-Ag-Cu alloy family is believed to be the best choice[2-4]. Compared with conventional Sn-Pb solder, Sn-Ag-Cu solders exhibit superior tensile......
is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %. Key words: Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical... of various contents of Ce on microstructure and mechanical properties of Sn-Ag-Cu system solder alloys. 2 Experimental 2.1 Alloy design and preparation The raw materials are combined......
containing Cu, Ni, Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces, and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer. Moreover, the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC) coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate. Key words: Ni coating; Sn-Ag-Cu alloy; SiCp/Al composite; wetting......
accelerates the crystallization and growing up of IMC. Key words: lead-free solder; Sn-Ag-Cu alloy; IMC thickness; uniform design ...-free systems have been developed. Among the various alloy systems being considered as lead-free solder candidates, Sn-Ag-Cu alloys have been recognized as the most promising material because......
文章编号:1004-0609(2015)-11-3119-07 Sn-Ag-Cu无铅球栅阵列焊点塑性表征 杨淼森1, 2,孙凤莲1,孔祥霞1,周云芳1 (1. 哈尔滨理工大学 材料科学与工程学院,哈尔滨 150080； 2. 哈尔滨职业技术学院 机械工程学院,哈尔滨 150081) 摘 要:通过纳米压痕的方法,采用塑性应变与总应变的比值表征塑性,对... and performance of Sn-Ag-Cu lead-free BGA solder joint YANG Miao-sen1, 2, SUN Feng-lian1, KONG Xiang-xia1, ZHOU Yun-fang1 (1. School of Material Science and Engineering, Harbin University of Technology, Harbin......
effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250...℃. Key words: lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus CLC number: TG146.1 ......
furnace and sintered at 175 °C for 2 h. Finally, the SAC/Ag-GNSs (Table 1) samples were punched using a hydraulic press. Table 1 Chemical composition of Sn-Ag-Cu/Ag-GNSs alloy (wt.%) Figure 1...Trans. Nonferrous Met. Soc. China 31(2021) 2454-2467 Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn-Ag-Cu composite solder joints Yong-dian HAN1,2, Jia-hang......
