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Trans. Nonferrous Met. Soc. China 20(2010) s988-s992 Preparation of SiCp/A356 electronic packaging materials and its thixo-forging WANG Kai-kun(王开坤), KANG Yong-lin(康永林), SONG...; accepted 15 July 2010 Abstract: The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum......
Microstructure and electric properties of Sip/Al composites for electronic packaging applications XIU Zi-yang(修子扬), WU Gao-hui(武高辉), ZHANG Qiang(张 强), SONG Mei-hui(宋美慧), TIAN Shou-fu... environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, particle volume......
Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites WANG Kai-kun(王开坤) 1, WANG Fu-yu(汪富玉)1, CHEN Xue-jun(陈学军)2, WANG Lu(王 璐)2, MA Chun-mei(马春梅)1 1. School... 13 May 2010; accepted 25 June 2010 Abstract: Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process......
Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging WANG Xiao-feng(王小锋)1, 2, WU Gao-hui(武高辉)2, WANG Ri-chu(王日初)1, XIU Zi-yang(修子扬)2, YU Kun(余 ..., China Received 15 July 2007; accepted 10 September 2007 Abstract: In order to improve the thermal properties of MMCs for electronic packaging, the concept of fabrication MMCs with particular......
composites; pressureless infiltration; kinetics; electronic packaging CLC number: TB333 Document code: A electronic packaging and thermal management[1]. Electronic packaging materials are required to possess compatible CTEs with the IC, thus the composites with high volume fraction......
Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoformingGUO Ming-hai(郭明海), LIU Jun-you(刘俊友), JIA Cheng-chang(贾成厂), JIA Qi-jin(贾琪瑾), GUO Shi-ju(果世驹) (School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China)Abstract:The electronic packaging shell with high......
Trans. Nonferrous Met. Soc. China 25(2015) 1995-2002 Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy Dan...) (as-tested) and a CTE of 10.79×10-6 /K (20-100 °C). Key words: electronic packaging material; Cu/Invar composite; rolling; annealing 1 Introduction In recent years, with the development of high......
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper compositesKai-Kun WangSchool of Materials Science and Engineering,University of Science and Technology Beijing摘 要:To fabricate electronic packaging shell of copper-matrix composite with characteristics of high thermal conductivity and low thermal expansion coefficient......
Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications CHEN Guo-qin(陈国钦)1, XIU Zi-yang(修子扬)2, MENG Song-he(孟松鹤)3, WU Gao-hui(武高辉)1, ZHU... reinforcement content (φp=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB2p/Cu composites were......
and Electronic Packaging, 1999, 22(3): 233-241. [3] MERCADO L L, LEE T T, KUO S M, LEE R. Process-induced thermal effect on packaging yield of RF MEMS switches[A]. American Society of Mechanical Engineers, EEP, v 2, Electronic and Photonic Packaging, Electrical Systems and Photonics Design and Nanotechnology[C]. New Orleans: ASME, 2002, 25-32. [4] DE SILVA A. P, LIU L, HUGHES H G. Impact of Thermal Cycles......
