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Nonferrous Met Soc China, 2005, 15(2): 227-230. [11] Wu Gao-hui, Zhang Qiang, Chen Guo-qin. Properties of high-reinforcement-content aluminum matrix composite for electronic packages[J]. Journal...): 226-229. [14] WU Gao-hui, XIU Zi-yang, ZHANG Qiang. Properties of the environmental-friendly Si/Al composite for electronic packages fabricated by squeeze casting technology[J]. Journal of Shanghai......
, 157(3): 36-39. [8] HEMAMBAR C, RAO B S, JAYARAM V. Al-SiC electronic packages with controlled thermal expansion coefficient by a new method of pressureless infiltration [J]. Materials... Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites WANG Kai-kun(王开坤) 1, WANG Fu-yu(汪富玉)1, CHEN Xue-jun(陈学军)2, WANG Lu(王 璐)2, MA Chun-mei(马春梅)1 1. School......
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that the thicker gold plating, the less discoloration degree for ceramic packages. Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide gold plating. The relationship between the gold plating thickness and the amount of diffused Ni to the gold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃for 15 min was also studied. When......
temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating, the less discoloration degree for ceramic packages. Non... of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃ for 15 min was also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Co plating systems......
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High Temperature Oxidation as a Production Route for Electronic Materials () 摘要:Oxidation of metallic components often results in degradation and structural failure, preven-tion is therefore... materials. 关键词:oxidation; electronic material; superconductor; thin oxide film; [全文内容正在添加中] ......
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Electronic and optical properties of anion-doped c-ZrO2 from first-principles calculationsDING Jia-feng(丁家峰), LI Xin-mei(李新梅), CUI Li-ling(崔丽玲), CAO Can(曹粲), WANG Hui-hai(王会海), CAO Jian(曹建) (School..., electronic and some optical properties of C and N doped cubic ZrO2 (c-ZrO2) in 24-atom systems were investigated. It is found from the formation energies calculations that N ions are easier to be doped......
for electronic packages [J]. Electronic&Packaging, 2006, 6(2): 16-19. [33] 武高辉, 修子扬, 张 强, 宋美慧. 一种环保型电子封装用复合材料[J], 红外与激光工程, 2006, 35(5): 161-164.WU Gao-hui, XIU Zi-yang, ZHANG Qiang, SONG Mei-hui...出高硅铝合金电子封装材料的发展方向. 关键词:高硅铝合金;电子封装;性能;熔炼铸造;浸渗法;喷射沉积 中图分类号: 文献标志码:A Research progress of high aluminum-silicon alloys in electronic packaging XIE Li-chuan, PENG......