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of the interfacial reactions in Ni/Sn/Cu sandwich structures[J]. Journal Electronic Materials, 2006, 35(11): 1955-1960. [14] LAURILA T, VUORINEN V, KIVILAHTI J K. Interfacial reactions between lead-free solders.... [16] WATANABE H, SHIMODA M, HIDAKA N, SHOHJI I. Effect of interfacial reaction in Sn-Ag-Cu solder alloy with Ni addition[J]. Key Engineering Materials, 2011, 462/463: 247-252. (编辑 龙怀中)......
and TC4 soft alloy [J].Transactions of the China Welding Institution, 2009, 30(2): 117-120. [12] KOEBEL M M, HAWI N E, LU J, GATTIKER F, NEUENSCHWANDER J. Anodic bonding of activated tin solder alloys... s-1,拍摄过程2 s,超声辅助铺展设备示意图如图2所示. 图1 液态钎料动态铺展示意图 Fig. 1 Schematic diagram of dynamic spreading of liquid solder 图2 超声辅助铺展设备示意图 Fig. 2 Schematic diagram of experimental device......
Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn–Zn–Cu Solder AlloyBismarck Luiz Silva1,Rodrigo Valenzuela Reyes2,Amauri Garcia3,Jos Eduardo Spinelli21. Department... Engineering,University of Campinas,UNICAMP摘 要:The present investigation is based on the results of a directionally solidified(DS) Sn–9 wt%Zn–2 wt%Cu alloy......
; 合金过热度; 有效雾化率; 粉末特性; Sn-Ag-Cu lead-free solder powder; inner diameter of delivery tube; superheat condition for alloy; efficient atomization efficiency; property of powder; [全文内容正在添加中] ......
Influence of Composition on Properties of BNT-BT Lead-Free Piezoceramics Gao Chunhua1,Chen Zhigang1,Huang Xinyou1,Liu Huiping1 (1.School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China) Abstract:Lead-free piezoelectric ceramics of (Bi1/2Na1/2)TiO3-BaTiO3(BNT-BT) were prepared by the conventional piezoelectric ceramic preparation technique (free air atmosphere......
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="ChDivSummary">The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K.Dynamic contact angles between the solder... results are of practical interest for composite lead-free solders’preparations and joining of Sn–17Bi–0.5Cu to Cu substrate.关键词:......
University3. Faculty of Education, Department of Computer and Instructional Technologies, Siirt University摘 要:The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries.Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic......
of stress-strain relationship with an improved anand constitutive model for lead-free solder Sn-3.5Ag [J]. IEEE Transactions on Components and Packaging Technologies, 2005, 28(1): 111-116 (Edited... Application of Anand’s constitutive model on twin roll casting process of AZ31 magnesium alloy HU Xiao-dong(胡小东)1, JU Dong-ying(巨东英)1, 2 1. Department of Material Science and Engineering......