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J. Cent. South Univ. (2021) 28: 1966-1977 DOI: https://doi.org/10.1007/s11771-021-4745-3 Sintering microstructure and properties of copper powder prepared by electrolyzation and atomization LI Pei... and Springer-Verlag GmbH Germany, part of Springer Nature 2021 Abstract: The almost completely dense copper was prepared by ultrafine copper powder prepared with both methods of electrolysis and novel water......
J. Cent. South Univ. (2017) 24: 2245-2252 DOI: https://doi.org/10.1007/s11771-017-3634-2 Effect of ultraviolet mutagenesis on heterotrophic strain mutation and bioleaching of low grade copper ore WU... 2017 Abstract: The effect of ultraviolet mutagenesis on a heterotrophic strain (Providencia JAT-1) mutation was studied and bioleaching of low grade copper ore with mutant bacteria was investigated......
Thermal expansion of MWCNT-reinforced copper composite XU Long-shan(许龙山), CHEN Xiao-hua(陈小华), PAN Wei-ying(潘伟英), LI Wen-hua(李文华), YANG Zhi(杨 植), PU Yu-xing(蒲玉兴), YI Guo-jun (易国军) , YI Bin... carbon nanotube (MWCNT)-reinforced copper composite was fabricated by a novel method, which involves solution phase synthesis of MWCNT-implanted cuprous oxide composite spheres, formation of MWCNT/ copper......
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主要化学组成 Table 1 main chemical compositions of low grade copper sulfide concentrate (mass fraction, %) 表2 铜精矿中铜的化学物相分布 Table 2 Copper occurences in copper sulfide concentrate 由表1可知,该...硫化铜精矿处理工艺流程示意图如图1所示. 图1 低品位硫化铜矿"氨性氧化浸出-脉冲电积"工艺流程示意图 Fig. 1 Schematic flowchart of low grade copper sulfide concentrate "oxidative ammonia leaching-pulse electro- deposition" process 1.3......
Effect of added cobalt ion on copper electrowinning from sulfate bath using doped polyaniline and Pb-Ag anodes HUANG Hui(黄 惠)1, ZHOU Ji-yu(周继禹)2, GUO Zhong-cheng(郭忠诚)1 1. Faculty... December 2009 ____________________________________________________________________________________________ Abstract: Effect of added Co2+(aq) on copper electrowinning was studied using doped......
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Comparison of microstructures in electroformed and spin-formed copper liners of shaped charge undergone high-strain-rate deformation FAN Ai-ling(范爱玲)1, LI Shu-kui(李树奎)1, TIAN Wen-huai(田文怀)2...; Abstract: The as-formed and post-deformed microstructures in both electroformed and spin-formed copper liners of shaped charge......
Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate TIAN Yan-hong(田艳红)1, WANG Chun-qing(王春青)1, Y. Norman ZHOU2 1. State Key Laboratory of Advanced Welding...; Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated......
A, SCOTT K. Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards [J]. Journal of Chemical Technology and Biotechnology, 2002, 77: 449-457. [18] AL-SUHYBANI...Trans. Nonferrous Met. Soc. China 24(2014) s157-s161 Selective recovery of Sn from copper alloy dross and its heat-treatment for synthesis of SnO2 Jung-Il LEE1, Jong Bum PARK1, Tae Wan KIM1, Man-Sik......
