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号:TG 111 文献标识码:A Interfacial reactions between Sn-Cu solder alloy and Cu/Ni coatings during reflow soldering DIAO Hui, WANG Chun-qing, ZHAO Zhen-qing, TIAN Yan-hong... layers increase with soldering temperature, whereas decreases with time. Key words: SnCu solder alloy coating; Cu/Ni coating; intermetallic compound; soldering; interfacial reaction  ......
Piezoelectric and dielectric properties of Lix(K0.46Na0.54)1-xNb0.86Ta0.1Sb0.04O3 lead-free ceramics CHEN Zhi-wu(陈志武) 1, HU Jian-qiang(胡建强)2 1. College of Materials Science and Engineering, South...; Abstract: Lead-free piezoelectric ceramics Lix......
) Abstract: The solder joint reliability of a 0.5mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within... show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain......
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder JointHaifei Zhou1,Jingdong Guo1,Qingsheng Zhu1,Jianku Shang1,21. Shenyang National Laboratory for Materials Science... between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn......
; 文献标识码: A Fillet-lifting mechanism for Sn-Bi-Ag-Cu solder joint in lead-free wave soldering HE Peng1, ZHAO Zhi-li2, QIAN Yi-yu1, LI Zhong-suo3 (1. State... of the mainly used lead-free solder in wave-soldering. The analysis results show that the segregation of Bi becomes more remarkable at the corner of the solder body/PCB pad. The local irregularity of Bi......
[J]. Materials Science and Engineering A, 2018, 723: 296-305. [7] 杨桂香, 杨景周, 杨景浩. 一种无铅黄铜合金: 中国, CN 103725919 A[P]. 2014-04-16. YANG Gui-xiang, YANG Jing-zhou, YANG Jing-hao. Lead-free brass alloy... 102925744 A[P]. 2013-02-13. LIU Rui-qing, CAI Wei, QIU Guang-bin, WANG Gang, XIAO Xiang-peng, LIU Yang, DENG Yu-sheng, LI Shuang-long. Lead-free brass alloy and preparation method thereof: China, CN......
. [39] TU K N. Solder joint technology: Materials, properties and reliability[M]. New York: Springer, 2007: 338-345. [40] ZENG K, TU K N. Six cases of reliability study of Pb-free solder joints.... Thermomigration in Pb-free SnAg solder joint under alternating current stressing[J]. Applied Physics Letters, 2009, 94(9): 092107. [44] SU Y P, OUYANG F Y. The growth of Ag3Sn intermetallic compound......
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are driving the microelectronics industry towards implementation of lead-free solder alloys, although the Pb metal used for electronic solders is reported to be less than 1% of the total Pb consumption worldwide[4-7]. Among all lead-free solder alloys, the SnAgCu solder system, which has better thermo-mechanical properties compared with those of SnPb solder, is proven to be one of the promising......
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