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is a solid material and does not have the fluidity of the fluid. It cannot flow inside the fracture with the fracture propagation. Therefore, there is no "water-wedge effect" that can cause a stress......
for the large hadron collider[J]. Thin Solid Films, 2006, 515(2): 382-388. [39] BENVENUTI C, CHIGGIATO P, CICOIRA F, et al. Nonevaporable getter films for ultrahigh vacuum applications[J]. Journal of Vacuum......
. The sheet blank was defined as the elastoplastic deformable shell. The eight-node C3D8T solid element coupled with temperature and displacement was used to mesh the blank, and 5-layer mesh was set......
]. Journal of Alloys and Compounds, 2002, 334(1/2): 224-227. [58] LEE T Y, CHOI W, TU K N, JANG J W, KUO S M, LIN J K, FREAR D R, ZENG K, KIVILAHTI J K. Morphology, kinetics and thermodynamics of solid..., 1998, 27(12): 1367-1371. [104] OLIVER W C, NIX W D. High temperature deformation of oxide dispersion strengthened Al and Al-Mg solid solutions[J]. Acta Metallurgica, 1982, 30(7): 1335-1347. [105] PEI M......
. Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites[J]. Thin Solid Films, 2006, 504(1/2): 401-404. [58] 韩永典. Ni涂层碳纳米管增强Sn-Ag-Cu无铅钎料的可靠性研... joint microstructure, IMC and strength[J]. Thin Solid Films, 462/463: 370-375. [111] 肖克来提, 杜黎光, 孙志国, 等. SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化[J]. 金属学报, 2001, 37(4): 439-444. SHAWKRET Ahat, DU Liguang, SUN......
度),进而提高材料的综合性能.但同时也要尽可能降低随淬火冷却速率提高引起的淬火残余应力大的负面影响,其实质是寻求能使铝合金材料性能极大化与残余应力极小化的淬火冷却过程的全程协调控制理论与技术. 图12 固溶样品的光学金相照片(白色区域为再结晶晶粒)[3] Fig. 12 Optical metallography photos of solid solution samples (white region: recrystallized grains)[3] 图13 再结晶分数随固溶温度的变化规律[3] Fig. 13 Changes of crystallization fractions with solid solution temperatures[3] 辊底式喷淋淬火与固溶加热装置往往连成一体,一般称为辊底炉.高强铝合金材料在固......
, NOVIKOV D L, MRYASOV O N, FREEMAN A J. Ternary site preference energies, size misfits and solid solution hardening in NiAl and FeAl[J]. Acta Mater, 1998, 46(10): 3433?3442. [32] SAHU B R......
gradient at the solid/liquid interface, and R is the crystal growth rate) is increased, the arrangements of the morphology of these three kinds of phases are changed from about 45? (Fig.1(a)) to 0..., %), if the gradient G at solid/liquid interface is 200 K/cm, the angle can be changed from 90? to 0? as the growth rate is decreased from 12 mm/min to 6 mm/min. The reason maybe lies in the fact that the ratio G/R......
. Rutile TiO2 nanorod arrays directly grown on Ti foil substrates towards lithium-ion micro-batteries[J]. Thin Solid Films, 2011, 519: 5978-5982. [81] YANG Yang, KIM D, YANG Min, SCHMUKI P. Vertically......
reactions with particles and atoms of Mg and Mn in solid solution. XIAO et al [60] investigated the effect of hot backward flow spinning process on the microstructure and mechanical properties of spray......
