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of Technology,Harbin 150001,China摘 要:Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu(SAC) solder powders,mixing with flux and reflowing at 260 ℃ for 60 s.The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were......
, developing lead-free free-cutting brass materials has become a necessary and significant research focus. Lead-free brass is designed by adding free- machining additives into Cu–Zn alloy instead of lead..., AGRAWAL A N. Corrosion and dealloying of cast lead-free copper alloy–graphite composites [J]. Corrosion Science, 2000, 42(9): 1553-1571. [8] KIM J K, ROHATGI P K, CHOI J O, CHOI C O. Wear properties......
Influence of CeO2 doping amount on property of BCTZ lead-free piezoelectric ceramics sintered at low temperature黄新友1,2,邢仁克1,2,高春华1,2,陈志刚11. School of Materials Science and Engineering, Jiangsu University摘 要:Ba0.85Ca0.15Ti0.9Zr0.1O3(BCTZ) lead-free piezoelectric ceramics co-doped with CeO2(x=0.1 wt.%, 0.2 wt.%, 0.3 wt.%, 0.4 wt.%, 0.5 wt.%) and Li2CO3......
Influence of CeO2 doping amount on property of BCTZ lead-free piezoelectric ceramics sintered at low temperature黄新友1,2,邢仁克1,2,高春华1,2,陈志刚11. School of Materials Science and Engineering, Jiangsu University摘 要:Ba0.85Ca0.15Ti0.9Zr0.1O3(BCTZ) lead-free piezoelectric ceramics co-doped with CeO2(x=0.1 wt.%, 0.2 wt.%, 0.3 wt.%, 0.4 wt.%, 0.5 wt.%) and Li2CO3......
was selected to prepare the casting alloy by the vacuum medium-frequency induction melting method, the melting point and the microstructure were studied by DTA and SEM, and the wettability of the solder alloy with Ni was tested tentatively. The results show that, the melting temperature of the solder alloy is in the range of 451.36?506.49 ℃; α+β eutectic structures form in the solder alloy; because......
Influence of Sb2O3 doping on the properties of KBT-NBT-BT lead-free piezoelectric ceramicsHUANG Xinyou,GAO Chunhua,WEI Minxian,CHEN Zhigang,and CUI Yongzhen School of Materials Science and Engineering,Jiangsu University,Zhenjiang 212013,China摘 要:0.144(K0.5Bi0.5)TiO3-0.85(Na0.5Bi0.5)TiO3-0.006BaTiO3(KBT-NBT-BT) lead-free piezoelectric ceramics were......
Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin FilmsJ.K.ShangShenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of SciencesDepartment of Materials Science and Engineering,University of Illinois at Urbana-Champaign摘 要:The thermodynamic conditions for dewetting of a liquid solder drop......
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG JointsM.L.Huang,F.YangElectronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology摘 要:Solder size effect on early stage interfacial intermetallic compound(IMC) evolution......
Microstructure,wetting property of Sn-Ag-Cu-Bi-xCe solder and IMC growth at solder/Cu interface during thermal cyclingYuan Wang1,Xiu-Chen Zhao1,Ying Liu1,Yong Wang1,2,Dong-Mei Li21. School... of adding small amounts of cerium(Ce) to Sn-3.3 Ag-0.2 Cu-4.7 Bi solder on microstructure,wettability characteristic,interfacial morphology and the growth of interfacial intermetallic compound(IMC......
Microstructure and Performances of Nanocrystalline Zinc-nickel Alloy Coatings LI Guang-yu1,NIU Li-yuan1,JIANG Zhong-hao1,LIAN Jian-she1 (1.The Key Lab of Automobile Materials, Ministry of Education, China, College of Materials Science and Engineering, Jilin University, Nanling Campus, Changchun, 130025, China) 摘要:Nanocrystalline zinc-nickel alloy coatings were deposited from an alkaline......