共搜索到18863条信息,每页显示10条信息,共1887页。用时:0小时0分0秒218毫秒
Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn–xZn Solders Without Flux in AirZhi-Wei Lai1,2,3,Zhe-Yuan Huang2,4,Chuan Pan3,Hui-Qiao Du5,Xiao-Guang...-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa......
Crystallization and dielectric properties of lead-free glass-ceramic composites with Gd2O3 additionZHOU Yi, ZHANG Qingmeng, LUO Jun, TANG Qun, and DU Jun Advanced Electronic Materials Institute, General Research Institute for Nonferrous Metals, Beijing 100088, China摘 要:Lead-free glass-ceramic composites in barium sodium niobate silica system with Gd2O3......
Structure and Piezoelectric Properties of Lead-Free Na0.5Bi0.5TiO3 Nanofibers Synthesized by ElectrospinningDi Zhou1,Youhua Zhou1,Yu Tian1,Yafang Tu1,Guang Zheng1,Haoshuang Gu21. School of Physics...="ChDivSummary" name="ChDivSummary">Lead-free Na0.5Bi0.5TiO3(NBT) nanofibers with the perovskite structure were prepared by the electrospinning method.The nanofibers were about 200-300 nm in diameter and up......
Research progress in lead-less or lead-free three-dimensional perovskite absorber materials for solar cellsHuan-yu Zhang1,Rui Li1,Wen-wu Liu2,Mei Zhang1,Min Guo11. School of Metallurgical..." name="ChDivSummary">The trend toward lead-free or lead-less perovskite solar cells(PSCs) has attracted increasing attention over the past few years because the toxicity of lead(Pb) is one......
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder JointsX.J. Wang1), Q.L. Zeng1), Q.S. Zhu1), Z.G. Wang1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials..., USA摘 要:Effects of electromigration on microstructure, shear strength, and fracture behavior of solder joints were investigated by single-ball shear samples......
Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging毕晓阳,胡小武,LI Yulong,JIANG XiongxinKey Lab for Robot and Welding Automation of Jiangxi...) of Sn-16 Sb/Cu(wt%) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16 Sb solder and Cu substrate after thermal aging are Cu3 Sn and Cu6......
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder JointsHao Zhang1,Qing-Sheng Zhu1,Zhi-Quan Liu11. Institute of Metal Research, Chinese Academy of Sciences摘 要:FeeNi films with compositions of Fee75Ni,Fee50Ni,and Fee30Ni were used as under bump metallization(UBM)to evaluate the interfacial reliability of SnAgCu/FeeNi solder......
Effects of Na/K ratio on the phase structure and electrical properties of NaxK1-xNbO3 lead-free piezoelectric ceramicsZHANG Qian, ZHANG Boping, Li Haitao, and SHANG Pengpeng School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China摘 要:Lead-free piezoelectric NaxK1-xNbO3(x = 0.3-0.8)(NKN) ceramics......
Trans. Nonferrous Met. Soc. China 22(2012) s656-s660 Microforming of superplastic 5083 aluminum alloy Md. Abu Mowazzem HOSSAIN1, Sung-Tae HONG1, Kyu-Yeol PARK1, Young-Sang NA2 1. School of Mechanical...: The mechanical behavior of superplastic 5083 aluminum alloy during microforming process was investigated by finite element analysis. A micro V-groove die was modeled to analyze the effects of forming......
Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing processWEI Xiaofeng,WANG Richu,FENG Yan,ZHU Xuewei,and PENG Chaoqun School of Materials Science and Engineering... investigated during annealing at 453,523,and 543 K for up to 240 h.The Au/Sn combination formed a rapid diffusion system.Even in rolled Au-Sn solder,three phases,such as AuSn,AuSn2,and AuSn4,were formed.After......