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J. Cent. South Univ. Technol. (2011) 18: 1813-1818 DOI: 10.1007/s11771-011-0907-z Characteristics of thickness distribution of tailor-welded tube hydroforming CHU Guan-nan(初冠南)1, 2, LIU Gang(刘钢)3... Berlin Heidelberg 2011 Abstract: Both experimental and mechanical analyses were carried out to investigate the characteristics of thickness distribution for tailor-welded tube (TWT) hydroforming......
Sn2.5Ag0.7Cu0.1RExNi/Cu(x=0, 0.05, 0.1, %)接头界面粗糙度及IMC层的平均厚度 Fig. 5 Roughness and IMC average thickness of Sn2.5Ag0.7Cu0.1RExNi/Cu (x=0, 0.05, 0.1, %) solder joint interface in different thermal cycling... substrate. The morphology of the IMC in soldered joints transfers from wavy-shape into larger bamboo shoots with the increasing of thermal cycling, which causes increase of roughness and thickness......
Thickness of metallic layers from pulsed eddy-current nondestructive measurements ZHAO Liang(赵亮), CHEN Deng-feng(陈登峰), LU Ying(卢英), LI Chang-hua(李昌华) (Department of Information and Automation, Xi’an University of Architecture and Technology, Xi’an 710055, China) Abstract: By using pulsed eddy-current (PEC), a neural network was adopted to forecast the thickness of metal and the distance between......
to the formation of IMC, and the hole shape (CuxNi1-x)6Sn5 forms in the soldering interface. With low-temperature soldering process, the fitting line of the IMC thickness and aging time is totally...时效时间延长,添加Ni颗粒后IMC的致密性明显提高,钎料中元素的互扩散系数明显降低,IMC层厚度没有出现明显的增长. 图6 150℃时效时IMC厚度与的关系 Fig. 6 Relationship between IMC thickness and square root of aging time after aging at 150 ℃ 图7 125......
Article ID: 1003-6326(2005)06-1258-06 Variations of properties across plate thickness for Al alloy 7010 M. Salazar-Guapuriche1, 2, Y. Y. Zhao2, A. Pitman3, A. Greene3 (1. Materials..., UK) Abstract: The variations of electrical conductivity and hardness across the thickness of an Al alloy 7010 plate under the temper condition T7651 were investigated. The electrical conductivity......
. The simple theory discussed for the growth of a reaction product by solid state diffusion between reactants originally in contact, predicts that the thickness of IMC layer is proportional to the square root... Abstract: Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow......
Formation of interfacial brittle phases sigma phase and IMC in hybrid titanium-to-stainless steel joint Min Ku LEE, Jung Gu LEE, Jong Keuk LEE, Sung Mo HONG, Sang Hoon LEE, Jin Ju PARK, Jae Woo... was mainly involved in an intensive reaction of the dissolved Ti with the molten filler elements. For the Ag-based filler alloys, the joint was mainly dominated by thick Ti2Cu, TiCu and Ti3Cu4 IMC layers......
RESEARCH OF FILM THICKNESS DURING DRAWING PROCESS LUBRICATED WITH O/W EMULSIONS+Yan Hengzhi1; Zhong Jue1; Wang Dianzuo2(1. Department of Mechanical Engineering. Central South University of Technology... process. we have established the mathematical model of film thickness lubricated with emulsions during drawing process, The film thickness calculated with the model under general condition is very close......
Thickness distribution of multi-stage incremental forming with different forming stages and angle intervalsLI Jun-chao(李军超), YANG Fen-fen(杨芬芬), ZHOU Zhi-qiang(周志强) (College of Materials Science... between the two adjacent stages (Δα) on thickness distribution was investigated. Firstly, a finite element method (FEM) model of multi-stage incremental forming was established and experimentally......
under the thermal-shearing cycling condition were investigated. The results show that Cu6Sn5 forms at the two interfaces, and its thickness increases with the thermal-shearing cycling. The morphology of Cu6Sn5 varies from scallop-type to planar-type with increasing thermal-shearing cycling periods. The IMC growth follows growth kinetics of parabola, implying that IMC growth is controlled by Cu atom......