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• Thermo-physical properties of Si_p/LD11 composites for electronic packaging

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  来源： 《中国有色金属学报(英文版)2005年第z2期》——修子扬 武高辉 张强 宋美慧

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• Electronic packaging materials prepared by powder injecting molding and pressure infiltration process

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  来源： 《Rare Metals2007年第6期》——YIN Fazhang), GUO Hong), JIA Chengchang), XU Jun), ZHANG Ximin), and ZHU Xuexin) ) National Engineering and Technology Research Center for Nonferrous Metals Composites, Beijing General Research Institute for Nonferrous Met-als, Beijing , China ) Materials Science and Engineering School, University of Science and Technology Beijing, Beijing , China

  Electronic packaging materials prepared by powder injecting molding and pressure infiltration processYIN Fazhang1), GUO Hong1), JIA Chengchang2), XU Jun1), ZHANG Ximin1), and ZHU Xuexin1) 1) National... School, University of Science and Technology Beijing, Beijing 100083, China摘 要:AlSiCp (65 vol.% SiC) electronic packaging materials were manufactured by powder......

• Microstructure and properties of Al/Si/SiC composites for electronic packaging

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  来源： 《中国有色金属学报(英文版)2012年第7期》——朱晓敏 于家康 王新宇

  Trans. Nonferrous Met. Soc. China 22(2012) 1686-1692 Microstructure and properties of Al/Si/SiC composites for electronic packaging ZHU Xiao-min, YU Jia-kang, WANG Xin-yu State Key Laboratory... for electronic packaging were fabricated by gas pressure infiltration. On the premise of keeping the machinability of the composites, the silicon carbide particles, which have the similar size with silicon......

• 含高体积分数SiC_p的铝基复合材料制备与性能

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  来源： 《中国有色金属学报2003年第5期》——张强 陈国钦 武高辉 姜龙涛 栾伯峰

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• 具有双层结构的电子封装用可激光 焊接Si_p-SiC_p/Al混杂复合材料

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  来源： 《中国有色金属学报(英文版)2014年第4期》——朱梦剑 李 顺 赵 恂 熊德赣

  Trans. Nonferrous Met. Soc. China 24(2014) 1032-1038 Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging Meng-jian ZHU, Shun LI, Xun ZHAO, De-gan XIONG... packaging applications. The gas tightness of components after laser welding (48 mPa×cm3)/s) can well match the requirement of advanced electronic packaging. Several kinds of these precision components......

• Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique

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  来源： 《Rare Metals2020年第11期》——Yan-Qiang Liu Jian-Zhong Fan Xin-Xiang Hao Shao-Hua Wei Jun-Hui Nie Zi-Li Ma Ming-Kun Liu Ya-Bao Wang

  Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy techniqueYan-Qiang Liu,Jian-Zhong Fan,Xin-Xiang Hao,Shao-Hua Wei,Jun-Hui Nie,Zi-Li...="ChDivSummary">Silicon/aluminum(Si/Al) composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites......

• Property measurements on spray formed Si-Al alloys

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  来源： 《中国有色金属学报(英文版)2007年第2期》——魏衍广 熊柏青 张永安 刘红伟 王锋 朱宝宏

  by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have... with gold finishes and soldered with Sn-Pb alloy without any difficulty. Key words: spray forming; Si-Al alloy; electronic packaging material; coefficient of thermal expansion     ......

• 混杂2D-C/Al电子封装复合材料的设计与制备

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  来源： 《中国有色金属学报2000年第z1期》——于家康 周尧和

  and fabrication of hybrid 2D-C/Al composites for electronic packaging Abstract: The size and volume fraction of silicon carbide particle in hybrid C/ SiCp per-form were designed, and hybrid 2D-C/Al electronic packaging composites of non-wetting system were fabricated by low pressure infiltration. Theoretical calculation shows that the SiCp with volume fraction of 0.5%~2......

• 放电等离子烧结制备高导热SiC_P/Al电子封装材料

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  来源： 《复合材料学报2010年第1期》——张永忠 贾成厂 郭宏 尹法章 张习敏

  ,抗拉强度为190 MPa,达到了电子封装材料对热学性能和力学性能的要求. 关键词:电子封装材料; 放电等离子烧结; 热导率; electronic packaging materials; spark plasma sintering; thermal conductivity; [全文内容正在添加中] ......

• 电子封装材料过共晶硅-铝合金的组织特征和热性能

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  来源： 《中国有色金属学报(英文版)2012年第6期》——余琨 李少君 陈立三 赵为上 李鹏飞

  Trans. Nonferrous Met. Soc. China 22(2012) 1412-1417 Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications YU Kun1, LI Shao-jun1... for using as the heat sink materials. Key words: Si-Al alloy; rapid solidification; thermal properties; electronic packaging application 1 Introduction Modern electronics demands efficient heat removal......