共搜索到14772条信息，每页显示10条信息，共1478页。用时：0小时0分0秒564毫秒
Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate TIAN Yan-hong(田艳红)1, WANG Chun-qing(王春青)1, Y. Norman ZHOU2 1. State Key Laboratory of Advanced Welding...; Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated......
. Diffusion bonding tests were carried out on the Gleeble-1500 testing machine and the specimens were successfully diffusion bonded at the superplastic temperature. The maximum specific strength is 0.82... with high specific strength. Key words: ZK60 magnesium alloy; lap bonding; superplasticity; specific strength CLC number: TG146.22 ......
relationships were developed to predict diffusion layer thickness, hardness and strength using response surface methodology. It is found that bonding temperature has predominant effect on bond characteristics. Joints fabricated at a bonding temperature of 450 ℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively. Key......
......
, a new lightweight epoxy-based abradable seal coating with high bonding strength was developed by an effective and porosity controllable mixing process that distributes spherical pores uniformly... and the bonding strength is as high as 18 MPa.The performance of the epoxy-based coating is comprehensively better than aluminum-based coatings in five essential indices. This study is expected to provide......
......
......
; constitutive model; splitting strength; bonding stress; slip ..., bond resistance drops no longer, but maintains stably at 30%-40% of ultimate bonding stress until bar is pulled out from grout concrete. From Table 3, it is seen that the ratio of residual strength......
......
......
