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of uniform interface. Key words: rapid solidification; Sn-6.5Zn solder; soldering joint; microstructure; mechanical properties 铅及其化合物由于具有毒性而被世界上多个国家禁止用于电子工业领域,因此,高性能无铅钎料的研究与开发成为近年来保证与提高微连接可靠性的关键技术之一[1-2].目... for soldering joint (mm): (a) Base metal; (b) Soldering joint 2 结果与分析 2.1 微观结构 本试验条件下制备的快速凝固态Sn-6.5Zn合金薄带厚度约60 μm,其凝固散热方式可以认为属于牛顿冷却方式,瞬时冷却速度可通过下式计算[15-16]:  ......
, China Received 12 March 2006; accepted 22 August 2006 Abstract: Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force......
号:TG 111 文献标识码:A Interfacial reactions between Sn-Cu solder alloy and Cu/Ni coatings during reflow soldering DIAO Hui, WANG Chun-qing, ZHAO Zhen-qing, TIAN Yan-hong... joints under different soldering techniques were observed and analyzed. The interface reaction during soldering was studied. The growth mechanism of the IMCs was discussed and the influences......
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soldering and aging HUANG Ming-liang1, 2, BAI Dong-mei1, 2 (1. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China; 2. Key Laboratory of Liaoning...) during soldering and the interfacial reactions between Sn-3.5Ag solder and electroless Ni-6.5% P during soldering and aging were investigated. The results show that the wetting angle is about 44......
the solders during soldering and aging were investigated. The results show that Cu6Sn5 layer formed at the interface exhibits a continuous scallop-shaped structure after soldering, the thickness of Cu6Sn5... (n) in growth kinetic of intermetallic compounds layer during aging increases with increasing La content. Ag elements exist in Sn-Ag eutectic structures after soldering, and Ag3Sn particles......
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焊工艺过程示意图 Fig. 1 Schematic diagram of ultrasonic-assisted soldering process of Cu/Sn/Cu system 2 结果及讨论 2.1 无声场作用下Cu/Sn固-液界面IMCs层的横截面,形貌及生长动力学 图2 Cu-Sn试样保温作用前微观组织的SEM像 Fig. 2... soldering system[J]. Acta Metallurgica Sinica, 2014, 50(3): 294-304. [7] LI Yuan-xing, ZHAO Wei-wei, LENG Xue-song, FU Qiu-jiao, WANG Lei, YAN Jiu-chun. Microstructure evolution and mechanical properties......
Trans. Nonferrous Met. Soc. China 27(2017) 722-732 Mechanism of Ag3Sn grain growth in Ag/Sn transient liquid phase soldering Hua-kai SHAO1,2,3, Ai-ping WU1,2,3, Yu-dian BAO1,2,3, Yue ZHAO1,3, Gui... (IMCs) evolution in Ag/Sn TLP soldering at different temperatures. Experimental results indicated that morphologies of Ag3Sn grains mainly were scallop-type, and some other shapes such as prism......
Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys LI Yuan-xing, ZHAO Wei-wei, LENG Xue-song, FU Qiu-jiao, WANG Lei, YAN Jiu-chun... soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 °C, which is lower than the solution strengthening temperature of Al-Cu alloys......