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脉冲电流对镍药型罩电铸速度的影响研究 田文怀1,贾成厂1,王雷1,李春华1 (1.北京科技大学材料物理与化学系,北京,100083) 摘要:为了制备纯镍药型罩,研究脉冲电铸时脉冲参数对电铸速度的影响规律.利用两种不同的镀液配方,分别改变占空比,频率,最大阴极电流密度,得出电铸速度随脉冲参数的变化规律.在单向脉冲或双向脉冲条件下,增大正向电流的占空比都能使电铸速度增加,但是随着占空比的增大,电铸速度增加幅度变小;频率的改变对电铸速度没有影响;阴极电流密度增加时电铸速度也均匀增加. 关键词:电铸; 药型罩; 电解镍; 脉冲; electroforming; shaped charge; electrolysis nickel; pulse; [全文内容正在添加中] ......
prepared by using direct current electroforming without any additives, and (111) fiber texture exists in the electroformed nickel prepared by using direct current electro-forming with additives. The deposits prepared by using direct current electroforming possess columnar grain with an average grain size of 30 μm in width and 170 μm in length. The deposits prepared with additives are composed......
of shaped charges prepared by electroforming technique were investigated by transmission electron microscopy (TEM). Meanwhile, the orientations distributing of the grains in the electroformed copper......
with nano-sized grains were prepared by the electroforming technique, and the deformation at ultrahigh strain rate was performed by explosive detonation. The as-formed and post-deformed microstructures......
Trans. Nonferrous Met. Soc. China 23(2013) 366-371 Manufacture of μ-PIM gear mold by electroforming of Fe-Ni and Fe-Ni-W alloys Seong Ho SON1, Sung Cheol PARK1, Wonsik LEE2, Hong-Kee LEE1 1. Heat... Received 2 May 2012; accepted 4 November 2012 Abstract: The micro gear mold for powder injection molding was made by electroforming process of Fe-Ni and Fe-Ni-W alloys using UV-lithography process......
Engineering, Nanjing University of Aeronaustics and Astronaustics, Nanjing 210016, China) Abstract: During the electroforming process of copper, the quality of electrodes was improved through polishing...效果, 不需要任何添加剂, 就能获得表面光亮平整, 组织致密的铜电铸层. 2) 硬质粒子的扰动能影响电沉积的结晶过程, 进而影响铜电铸层的微观组织结构. 3) 用硬质粒子摩擦法所制备的铜电铸层的显微硬度和抗腐蚀性能均明显提高. REFERENCES [1]Zhu D, Qu N S, Chan K C. Development of joint electroforming[J......
Penetration performance of W/Cu double-layer shaped charge linersWen-Jian Dong1,Jin-Xu Liu1,Xing-Wang Cheng1,Shu-Kui Li1,Wen-Qi Guo11. School of Materials Science and Engineering, Beijing Institute of Technology摘 要:Two kinds of W/Cu double-layer shaped charge liner(SCL) were prepared by chemical vapor deposition(CVD) combined with electroforming......
charge with nano-sized grains was prepared by electroforming technique and the ultra-high- strain-rate deformation was performed by explosive detonation. The as-electroformed and post-deformed... by electroforming technique and undergone a plastic deformation by explosive detonation. The microstructures of recovered slug were observed by transmission electron microscopy (TEM) for comparison with the un......
of boron filament-reinforced nanocrystalline Ni composites by electroforming QIAN Wanghuan, QU Ningsong, ZHU Zengwei, ZHU Di (College of Mechanical and Electrical Engineering, Nanjing University... nm的过程中,由于结合强度的下降,复合电铸层抗拉强度明显下降. (4) 200 ℃时,纳米晶对复合电铸层的强度依然具有明显的增强效果,但是在400 ℃时,由于晶粒迅速长大以及界面上脆性物质的析出,纳米晶对强度的提升效果已不再显著. 参考文献: [1] Tanabe Y, Nishikawa H, Seki Y, et al. Electroforming of Ni mold......
of current-fluid coupling in micro- electroforming[J]. Optics and Precision Engineering, 2009, 17(9): 2184-2190. [10] PURCAR M, TOPA V, MUNTEANU C, et al. Optimisation of the layer thickness distribution... on microstructure and mechanical properties of Ni stencil masks fabricated by pulse electroforming[J]. Japanese Journal of Applied Physics, 2012, 51(9): 09MJ03. [12] 裴和中, 黄攀, 史庆南, 等. 添加剂和电流密度对镍钴合金电铸层组织结构的......