共搜索到18968条信息，每页显示10条信息，共1897页。用时：0小时0分0秒359毫秒
with gold finishes and soldered with Sn-Pb alloy without any difficulty. Key words: spray forming; Si-Al alloy; electronic packaging material; coefficient of thermal expansion ... by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have......
Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoformingGUO Ming-hai(郭明海), LIU Jun-you(刘俊友), JIA Cheng-chang(贾成厂), JIA Qi-jin(贾琪瑾), GUO Shi-ju(果世驹) (School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China)Abstract:The electronic packaging shell with high......
Trans. Nonferrous Met. Soc. China 24(2014) 1032-1038 Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging Meng-jian ZHU, Shun LI, Xun ZHAO, De-gan XIONG... packaging applications. The gas tightness of components after laser welding (48 mPa×cm3)/s) can well match the requirement of advanced electronic packaging. Several kinds of these precision components......
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper compositesKai-Kun WangSchool of Materials Science and Engineering,University of Science and Technology Beijing摘 要:To fabricate electronic packaging shell of copper-matrix composite with characteristics of high thermal conductivity and low thermal expansion coefficient......
composites; pressureless infiltration; kinetics; electronic packaging CLC number: TB333 Document code: A electronic packaging and thermal management[1]. Electronic packaging materials are required to possess compatible CTEs with the IC, thus the composites with high volume fraction......
), 11.6×10-6 K-1 and 229 MPa, respectively. Key words: Al-50%SiC composites; powder metallurgy; thermal properties; flexural strength; electronic packaging material 1 Introduction Electronic packaging...Trans. Nonferrous Met. Soc. China 26(2016) 2647-2652 Microstructures and properties of Al-50%SiC composites for electronic packaging applications Fei TENG1,2, Kun YU1,2, Jie LUO1, Hong-jie FANG1......
Electronic structure of the SrAl2O4:Eu2+ persistent luminescence material Mika Lastusaari1,Jorma H2,Janne Niittykoski3,Pavel Novák4,Taneli Laamanen3 (1.o;2.o)ls(a)(o;3.Department of Chemistry...:The electronic structure of the strontium aluminate (SrAl2O4:Eu2+) materials was studied with a combined experimental and theoretical approach.The UV-VUV synchrotron radiation was applied in the experimental......
, it becomes an advanced electronic packaging material. There are different manufacturing processes to produce the hypereutectic Si-Al alloy, including the conventional gravity casting (GC) and semi... Trans. Nonferrous Met. Soc. China 22(2012) 1412-1417 Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications YU Kun1, LI Shao-jun1......
paste [J]. Journal of the Korean Institute of Electrical and Electronic Material Engineers, 2004, 17(6): 575-579. [5] ABTEW M, SELVADURAY G. Lead-free solders in microelectronics [J]. Materials...Trans. Nonferrous Met. Soc. China 22(2012) s683-s687 Laser-assisted deposition of Cu bumps for microelectronic packaging Won-Seok CHOI1, Joohan KIM 2 1. Department of Nano IT Fusion Program, Seoul......
matrix composites for electronic packaging fabricated by vacuum pressure infiltration casting[J]. Material Engineering, 1994(6): 9-12. [8]Premkumar M K, Yun D I, Sawtell R R. Advanced aluminum composites..., 得到光亮, 完整的镀层. 镀层于450℃恒温120s后, 镀层不变色, 未见起皮和鼓泡. 关键词: AlSiC电子封装基片; 气密性; 真空压力浸渗; 化学镀镍 中图分类号: TG146 文献标识码: A Fabrication and property of aluminum silicon carbide electronic packaging baseplates XIONG......
