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Relaxations and bonding mechanism of arsenic in-situ impurities in MCT: first-principles study Sun Li-zhong(孙立忠)1, 2, Zhong Xiang-li(钟向丽)1, Wang Jin-bin(王金斌)1, Chen Xiao-shuang(陈效双... structure. The bonding characteristics between the impurity and the host atoms are discussed by analysis of the valence charge density and the bonding charge density. The amphoteric behavior of arsenic......
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at interface of steel-backed Al-graphite semi-solid bonding plate ZHANG Peng(张 鹏)1, DU Yun-hui(杜云慧)1, LIU Han-wu(刘汉武)1, ZHANG Jun(张 君)1, ZENG Da-ben(曾大本)2, BA Li-min(巴立民)3 (1. Department..., Anshan 114014, China) Abstract: The ratio of Fe-Al compound at the bonding interface of solid steel plate to Al-7graphite slurry was used to characterize the interfacial structure of steel......
J. Cent. South Univ. Technol. (2009) 16: 0841-0844 DOI: 10.1007/s11771-009-0139-7 Bonding stress-slip constitutive behavior between bars and grout concrete ZHENG Yi(郑 怡)1, 2, LIU Ming(刘 明)2...; Abstract: To establish bonding stress-slip constitutive model between bars and grout concrete, 13 test specimens were employed to study the bonding behavior and the force transfer......
J. Cent. South Univ. Technol. (2008) 15: 684-688 DOI: 10.1007/s11771-008-0127-3 Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging LI Jun... (PSV-400-M2). And the thermosonic bonding features were observed by scanning electron microscope (JSM-6360LV). The results show that the input power of bonding is lower than that of no load. The input......
Article ID: 1003-6326(2005)06-1253-05 Superplasticity and diffusion bonding of magnesium alloy ZK60 YU Yan-dong(于彦东)1, 2, JIANG Hai-yan(蒋海燕)2, LI Qiang(李 强)2, ZAI Chun-quan(翟春泉)2.... Diffusion bonding tests were carried out on the Gleeble-1500 testing machine and the specimens were successfully diffusion bonded at the superplastic temperature. The maximum specific strength is 0.82......
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Trans. Nonferrous Met. Soc. China 22(2012) s645-s649 Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material Sangmok LEE1, Min-Geun LEE2, Sang-Pill LEE3, Geun-Ahn LEE1... material was fabricated by a drawing process and a subsequent heat treatment. During these processes, intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding......
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