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Electronic structures of TiN and TiC-Extension of Molecular Orbital Method into Crystals Gaoling Zhao1,Bin Song2 (1.State Key Lab laboratory of Silicon Materials, Department of Materials Science... and theoretical X-ray emission spectra for the valence bands of TiN and TiC are obtained with a molecular orbital method. In order to describe electronic structures of crystals, local clusters for the molecular......
Electronic structure of the SrAl2O4:Eu2+ persistent luminescence material Mika Lastusaari1,Jorma H2,Janne Niittykoski3,Pavel Novák4,Taneli Laamanen3 (1.o;2.o)ls(a)(o;3.Department of Chemistry...:The electronic structure of the strontium aluminate (SrAl2O4:Eu2+) materials was studied with a combined experimental and theoretical approach.The UV-VUV synchrotron radiation was applied in the experimental......
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J. Cent. South Univ. (2017) 24: 270-275 DOI: 10.1007/s11171-017-3427-2 First-principle study of electronic structure and optical properties of Au-doped VO2 HUANG De-wei(黄德伟)1, ZHAO Cui-hua(赵翠华)1... of Minerals Engineering, Guangxi University,Nanning 530004, China Central South University Press and Springer-Verlag Berlin Heidelberg 2017 Abstract: The electronic structure and optical properties......
Effects of Eu2O3 doping on microstructural and electronic properties of ZnO-Bi2O3-based varistor ceramics prepared by high-energy ball millingDONG Yu-juan(董玉娟)1, 2, 3, 4, CUI Feng-dan(崔凤单)2, JIAO Lei... Science and Engineering, Jiangsu University, Zhenjiang 212013, China;3. State key Laboratory of Electronic Thin Films and Integrated Devices (University of Electronic Science and Technology of China......
Microstructure and electric properties of Sip/Al composites for electronic packaging applications XIU Zi-yang(修子扬), WU Gao-hui(武高辉), ZHANG Qiang(张 强), SONG Mei-hui(宋美慧), TIAN Shou-fu... environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, particle volume......
Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites WANG Kai-kun(王开坤) 1, WANG Fu-yu(汪富玉)1, CHEN Xue-jun(陈学军)2, WANG Lu(王 璐)2, MA Chun-mei(马春梅)1 1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; 2. East China Research Institute of Electronic Engineering, Hefei 230088, China Received......
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Obsolescence optimization of electronic and mechatronic components by considering dependability and energy consumptionM. A. Mellal1, S. Adjerid1, D. Benazzouz1, S. Berrazouane2, E. J. Williams3,4(1.... The mechatronic and electronic equipment components are mostly affected by obsolescence. A new challenger unit possesses identical functionalities, but with higher performances. This work aims to find......
Structural, elastic and electronic properties of Cu-X compounds from first-principles calculationsLIU Yang(刘洋)1, WANG Jiong(汪炯)1, 2, GAO Qian-nan(高倩男)1, DU Yong(杜勇)1(1. State Key Laboratory of Powder Metallurgy (Central South University), Changsha 410083, China;2. School of Metallurgy and Environment, Central South University, Changsha 410083, China)Abstract:The structural, elastic and electronic......
