共搜索到18854条信息,每页显示10条信息,共1886页。用时:0小时0分0秒578毫秒
......
......
(c), 500 h (d) and 1 000 h (e) 4 Conclusions 1) Sn2.5Ag2.0Ni alloy was utilized to solder SiCp/Al composites substrates deposited with electroless Ni(5%P) and Ni(10%P) layers. Two kinds of micro... structure solder joint with Ni(P)/Cu metallization on Cu substrate [J]. J Alloy Compd, 2007, 437(1/2): 169-179. [12] SHARIF A, CHAN Y C. Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn......
.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed...Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrateCHEN Wenxue, XUE Songbai, WANG Hui, WANG Jianxin, and HAN Zongjie College of Materials......
Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder jointsGuo-qiang Wei,Lei Wang,Xin-qiang Peng,Ming-yang XueSchool of Mechanical and Automotive... of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni(SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu(SAC305)/ Cu solder joints aging at 373,403,and 438 K.The results show that(Cu1 x,Nix)6Sn5phase......
, 26(10): 23-26. [12]许天旱, 赵麦群, 刘新华. SnAgCu系无铅焊锡成分的优化研究[J]. 电子元件与材料, 2004, 23(8): 14-21. XU Tian-han, ZHAO Mai-qun, LIU Xin-hua. Study on the optimal free-lead solder alloy of Sn-Ag-Cu system[J...: A Wetting match performance of SnAgCuRE lead-free solder for surface mount component ZHANG Ke-ke, WANG Shuang-qi, YU Yang-chun, WANG Yao-li,FAN Yan-li, CHENG Guang-hui, HAN Li-juan (College......
Microstructure and mechanical property of Sn–Ag–Cu solder materialYi-Gang Kong1,Zhi-Gang Kong21. School of Mechanical Engineering, Taiyuan University of Science and Technology2. Research Laboratory of Electrical Contacts, Beijing University of Posts and Telecommunications摘 要:Among the lead-free solder materials,Sn-AgCu alloys have many advantages......
......
, China;2.National Key Laboratory of Reliability Physics of Electronic Product, Guangzhou 510610, China) Abstract:By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy... based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range......
-DALY A A, AL-GANAINY G S, FAWZY A, YOUNIS M J. Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy[J]. Materials & Design... V, KAMAT S V. Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn-Ag-Cu lead free solder alloy composites[J]. Materials Science &......