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="ChDivSummary">Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m~2 K) cooling condition......
Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu SubstrateQiulian Zeng 1,2) , Jianjun Guo 1) , Xiaolong Gu 1) , Xinbing Zhao 2) and Xiaogang Liu 1) 1) Zhejiang Province Key laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute, Hangzhou 310011, China 2) Department of Materials Science......
-like/flake Ag3Sn+β-Sn becomes fine equiaxed crystal; coarse compound phases exist when the content of Ce is up to 0.1%, which is harmful to microstructures of solder alloy and soldering seam. With regard to soldered joints, microstructures formation of the interface between Sn-Ag-Cu-Ce solder and Cu substrate (soldering seam) is different from that of Sn-Ag-Cu-Ce alloy itself, as a result......
">The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds(IMCs) layer(η-Cu6 Sn5 + e-Cu3 Sn) for various soldering... substrate. However, with the longer welding time such as 60 and 300 s, the Cu3 Sn IMC was formed at the interface between Cu6 Sn5 and Cu substrate. With the increase of soldering time, the thickness of total......
. The interface of the joint produced at 255 ℃ with various soldering times was analyzed by scanning electron microscope (SEM), X-ray energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The results show that CuZn IMC forms preferentially within the Cu substrate. The Cu5Zn8 IMC forms by the reaction of CuZn with Zn atoms diffused from the solder. The effect of the soldering time......
of minor Nd. However, adding 0.5% Nd into Sn-9Zn alloy leads to the formation of large "cross" shaped NdSn3 intermetallic compound (IMC). Under the conditions of lower soldering temperature or shorter soldering time, the addition of trace Nd in Sn-9Zn could improve the spreading properties. With the increase of soldering temperature or soldering time, the spreading property of Sn-Zn-Nd alloy......
was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of Cu5Zn8 and CuZn or Cu5Zn8, are formed at the interfaces of both Sn-9Zn/Cu-particles... solder greatly reduces the thickness of IMCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation......
410083, China Received 28 April 2016; accepted 30 December 2016 Abstract: The AuSn20/Ni joints were prepared by the reflow soldering technology and then annealed at solid-state temperature to form diffusion couples. The interfacial reactions and the growth kinetics of the intermetallic compounds (IMC) at the AuSn20/Ni soldering interface were investigated by scanning electron microscopy (SEM......
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Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder jointsGuo-qiang Wei,Lei Wang,Xin-qiang Peng,Ming-yang XueSchool of Mechanical and Automotive Engineering, South China University of Technology摘 要:The ......