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• Industrial experiment of copper electrolyte purification by copper arsenite

  来源： 《中南大学学报(英文版)2008年第2期》——郑雅杰 肖发新 王勇 李春华 许卫 简洪生 马玉天

  J. Cent. South Univ. Technol. (2008) 15: 204-208 DOI: 10.1007/s11771-008-0039-2 Industrial experiment of copper electrolyte purification by copper arsenite ZHENG Ya-jie(郑雅杰)1, XIAO Fa-xin(肖发新)1...;          Abstract: Copper electrolyte was purified by copper arsenite that was prepared with As2O3. And electrolysis experiments of purified electrolyte......

• Texture evolution and its simulation of cold drawing copper wires produced by continuous casting

  来源： 《中国有色金属学报(英文版)2011年第1期》——陈建 严文 李巍 苗健 范新会

  technology, the demand of finer copper wires has kept rising. Metallic wire drawing technology has advanced possibility of manufacturing the fine wires with a diameter less than 20 μm[1]. Therefore... of deformation and recrystallization in cold wire-drawn copper [J] Materials Science Forum, 2005, 495-497: 919-926. [3] WULFF F, BREACH C D, DITTMER K. Crystallographic texture of drawn gold bonding wires......

• TECHNICAL CONDITION AND DEVELOPIVIENT TREND OF CHINA COPPER PROCESSING

  来源： 《中国有色金属学报(英文版)1992年第1期》——Ji Guangming

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• 铜/钢反向凝固复合实验研究

  来源： 《中国有色金属学报1999年第3期》——于九明 王群骄 孝云祯 陈金英 闫谷丰 吴法宇

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• CAUSE OF FORMATION OF NODULAR COPPER PARTICLES ON ELECTROREFINED COPPER SUBSTRATE

  来源： 《中国有色金属学报(英文版)1994年第4期》——Lin Jianxin Li Xueliang Chen Hanhe He Jianbo Wu Jilie

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• smelting chlorination method applied to removal of copper from copper slags

  来源： 《中南大学学报(英文版)2015年第1期》——LI Lei(李磊) WANG Hua(王华) HU Jian-hang(胡建杭)

  smelting chlorination method applied to removal of copper from copper slagsLI Lei(李磊), WANG Hua(王华), HU Jian-hang(胡建杭) (State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization... and Technology),Kunming 650093, China)Abstract:In order to reasonably utilize the iron resources of copper slags, the smelting chlorination process was used to remove copper from copper slags. higher holding......

• EFFECT OF RARE EARTH ON CONDUCTANCE OF ALUMINUM WIRE

  来源： 《中国有色金属学报(英文版)1992年第1期》——Gao Guozhong He Weiyong Chen Jizhi

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• Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging

  来源： 《中南大学学报(英文版)2008年第5期》——李军辉 韩雷 钟掘

  J. Cent. South Univ. Technol. (2008) 15: 684-688 DOI: 10.1007/s11771-008-0127-3 Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging LI Jun...;     1 Introduction It has a long history that ultrasonic bonding technology has been applied to microelectronic packaging industry. At present, wire bonding is still commonly used......

• Simulated small-scale pilot heap leaching of low-grade copper sulfide ore with selective extraction of copper

  来源： 《中国有色金属学报(英文版)2008年第6期》——覃文庆 张雁生 黎维中 王军

  Simulated small-scale pilot heap leaching of low-grade copper sulfide ore with selective extraction of copper QIN Wen-qing(覃文庆), ZHANG Yan-sheng(张雁生), LI Wei-zhong(黎维中), WANG Jun(王 军) School...;                     Abstract: The bioleaching of low-grade copper sulfide ore and the selective......

• Effect of Y on structure and properties of copper and its alloy

  来源： 《中国有色金属学报(英文版)2007年增刊第1期(Part ⅡB)》——蔡薇 柳瑞清 谢水生 黄国杰 赵健 张珍锋

  precipitate characteristics and softening resistance of copper alloys contact wire[J]. Journal of Rare Metals, 2005, 23(4): 1006-1009. [15] HUANG De-bin. Nonferrous materials handbook[M].1st ed. Beijing... Effect of Y on structure and properties of copper and its alloy CAI Wei(蔡  薇)1, LIU Rui-qing(柳瑞清)1, XIE Shui-sheng(谢水生)2, HUANG Guo-jie(黄国杰)2, ZHAO Jian(赵  健)1, ZHANG Zhen-feng(张珍锋)1......